Semiconductor News & Analysis Feed

South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.

Camtek sells the cameras and measuring tools that let chipmakers confirm advanced packages are built correctly, and that job has become mission-critical as the industry stacks memory and logic together to feed AI accelerators. The Israeli inspection specialist is now flagging demand that management describes in terms it rarely uses. Video Muted An unprecedented order book Camtek (NASDAQ:CAMT | C

NEWS Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race Published on June 29, 2026 at 6:18 am by ABDUL RAHMAN in News SHARE Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 price target. The firm anticipates fa

Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race Abdul Rahman June 29, 2026 2 min read INTC +1.54% 2330.TW -0.81% Trade Intel on Coinbase Trading disclosure Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 pr

Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.

Semiconductors Tech China’s JCET to build new plant in Shanghai to expand advanced chip packaging US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development 2-MIN READ 0 Listen Make SCMP preferred on Google Xinmei Shen Published: 8:30am, 25 Jun 2026 Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.

According to market research firm Spherical Insights, which has been working in the semiconductor, advanced packaging, chip manufacturing, artificial intelligence hardware, and electronics supply chain industry for the last 10 years, their market study indicates that the global advanced chip packaging market is experiencing substantial growth and is expected to expand significantly through 2035.

MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services The chipmaker is hedging its bets with a dual packaging strategy as AI demand strains TSMC's capacity.

MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services The chipmaker's dual-sourcing strategy for AI silicon reflects both soaring demand and real capacity bottlenecks at TSMC.

Move a win for US chip titan as it looks to secure customers for foundry services Mediatek says it is now "one of the few" chip designers able to support customers using advanced packaging technologies from both Taiwan Semiconductor Manufacturing Co. and Intel. (Source photos by Cheng Ting-Fang and Reuters) TAIPEI -- MediaTek says it has started working with Intel for advanced chip packaging in

__fail__