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MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services The chipmaker is hedging its bets with a dual packaging strategy as AI demand strains TSMC's capacity.

MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services The chipmaker's dual-sourcing strategy for AI silicon reflects both soaring demand and real capacity bottlenecks at TSMC.

Move a win for US chip titan as it looks to secure customers for foundry services Mediatek says it is now "one of the few" chip designers able to support customers using advanced packaging technologies from both Taiwan Semiconductor Manufacturing Co. and Intel. (Source photos by Cheng Ting-Fang and Reuters) TAIPEI -- MediaTek says it has started working with Intel for advanced chip packaging in

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