Semiconductor News & Analysis Feed

Intel has filed a patent for XBM (Cross-Batch Memory), a novel memory architecture designed as an alternative to conventional High Bandwidth Memory (HBM). This technology aims to address current limitations in AI accelerators such as bandwidth, packaging costs, and complexity. Unlike traditional HBM

Intel has revealed a new high-bandwidth memory (HBM) architecture, called Cross-Batch Memory (XBM), in a patent filed in December 2024 and published in July 2026. XBM aims to overcome the high packaging costs and complexity associated with current interposer-based HBM by shifting DRAM cell fabricati

Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-