Semiconductor News & Analysis Feed

AMD has announced that its Versal adaptive programmable chip line will support the Universal Chiplet Interconnect Express (UCIe) standard, marking a significant step toward modular and heterogeneous computing in the semiconductor industry. Versal chips, which succeeded Xilinx FPGA products following

Intel has filed a patent for XBM (Cross-Batch Memory), a novel memory architecture designed as an alternative to conventional High Bandwidth Memory (HBM). This technology aims to address current limitations in AI accelerators such as bandwidth, packaging costs, and complexity. Unlike traditional HBM

Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-