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2026-05-04
Applied Materials to acquire NEXX advanced packaging unit By Investing.com - Investing.com South Africa
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za.investing.com 2026-05-04 Investing.com South Africa
2026-05-04
Applied Materials strikes NEXX deal as AI chip packages shift to larger panels - Stock Titan
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www.stocktitan.net 2026-05-04 Stock Titan
2026-05-04
Applied Materials to Acquire NEXX Business from ASMPT Limited, Expanding Advanced Packaging Portfolio for AI Technologies - Quiver Quantitative
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www.quiverquant.com 2026-05-04 Quiver Quantitative
2026-05-04
Applied Materials to acquire NEXX advanced packaging unit - Investing.com
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www.investing.com 2026-05-04 Investing.com
2026-05-04
Manufacturing Steady in April as Inflation and Iran War Weigh In
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eetimes.com 2026-05-04 News Desk
Manufacturing continued to expand in April despite supply chain issues and higher prices.
ManufacturingInflationGeopolitical RiskSupply ChainUS EconomyPMIRaw Material CostsEmployment Data
2026-05-04
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX - GlobeNewswire
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www.globenewswire.com 2026-05-04 GlobeNewswire
2026-05-04
Designing Chips In The Context Of Rapidly Evolving AI
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semiengineering.com 2026-05-04 Ann Mutschler
Long‑running agents, tool-calling LLMs, and multimodal chaos are rewriting edge compu...
AI chip designEdge AIChip architectureComputational performanceMemory hierarchyData movementRAS technologyMultimodal AI
2026-05-03
Intel’s ZAM Memory Threatens HBM’s AI Throne With 2x The Bandwidth of HBM4, More Capacity & Low Thermal Constraints - Wccftech
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wccftech.com 2026-05-03 Wccftech
2026-05-03
AI Servers Create New MLCC Trend: Will It Be the Next HBM? - TradingKey
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www.tradingkey.com 2026-05-03 TradingKey
2026-05-03
QNAP Unveils QAI-h1290FX Edge AI NAS with Blackwell GPU - Let's Data Science
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letsdatascience.com 2026-05-03 Let's Data Science
2026-05-03
QNAP Pairs a 6-Year-Old Zen 2 EPYC With NVIDIA’s 96GB RTX PRO 6000 Blackwell in Its New Edge AI NAS - Wccftech
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wccftech.com 2026-05-03 Wccftech
2026-05-03
QNAP’s new AI NAS supports NVIDIA’s 300W RTX PRO 6000 Blackwell Max-Q GPU with 96GB GDDR7 ECC memory - VideoCardz.com
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videocardz.com 2026-05-03 VideoCardz.com
2026-05-03
Why AXT, Inc. Stock Jumped 21% as AI Wafer Demand Put Its $100 Million Backlog in Focus - TechStock²
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ts2.tech 2026-05-03 TechStock²
2026-04-30
NoC Coherency Challenges Balloon With AI SoCs And Chiplets
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semiengineering.com 2026-04-30 Liz Allan
Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. C...
Network-on-ChipAI SoCChipletsCache CoherencyData MovementSystem IntegrationMulti-die DesignNoC Architecture
2026-04-29
AI in Design Verification: Where It Works and Where It Doesn’t
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eetimes.com 2026-04-29 Mike Bartley
AI streamlines verification by targeting repetitive tasks but can't replace expert signoff.
AIDesign VerificationSemiconductorICAI-assisted VerificationCoverage AnalysisRegression TestingDebug Efficiency
2026-04-29
STMicro Introduces STM32C5 for Cost-Sensitive Smart Devices
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eetimes.com 2026-04-29 Yashasvini Razdan
Introducing STM32C5 in India, STMicroelectronics explained how the new series targets cost-sensitive applications with improved performance, memory, and connectivity.
MicrocontrollerSTM32C5STMicroelectronicsARM Cortex-M33Ethernet integrationCost-sensitive designIndustrial IoTSmart devices
2026-04-24
What Hormuz Exposed About Our Semiconductor Supply Chain
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eetimes.com 2026-04-24 Kevin Berghoff
The semiconductor industry is facing a reckoning it has postponed for years.
Semiconductor Supply ChainSupply Chain DisruptionHelium ShortageGeopolitical RiskChip ManufacturingLogistics ShockAI Chip DemandCritical Material Dependency
2026-04-23
Can Edge AI Keep Up?
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semiengineering.com 2026-04-23 Ann Mutschler
As models evolve faster than silicon cycles, experts weigh how much adaptability archit...
Edge AIAI chipsHeterogeneous architectureModel updatesComputing powerHardware adaptationSoftware toolchainAI processors
2026-04-17
TSMC Chases Soaring AI Demand
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eetimes.com 2026-04-17 Alan Patterson
TSMC slams the gas to expand chip production for AI giants, but shortages loom.
TSMCAI chipsSemiconductor manufacturingChip capacity3nm process2nm processAI infrastructureChip foundry
2026-04-17
EU DARE Project Is Scrambling to Replace Codasip
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eetimes.com 2026-04-17 Pablo Valerio
EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.
EU Semiconductor ProjectDARE InitiativeRISC-V ArchitectureEuropean SupercomputingSemiconductor Supply ChainSecure ChipsEDA ToolsEuropean Tech Sovereignty