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Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article4Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterShare prices of both Intel and SK hynix have surged following aZDNet Koreareport claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with
2026-05-11
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www.newelectronics.co.uk 2026-05-11 New Electronics
Several customers are said to have approached the South Korean chipmaker with proposals that include direct investment in new manufacturing capacity and financial support for equipment purchases.These offers are certainly unusual in the memory sector, where chipmakers have traditionally funded their own expansion rather than relying on customer backing.The proposals reportedly include funding for