Semiconductor News & Analysis Feed

At VLSI 2026, Intel unveiled further details of its enhanced 18A-P process, a refinement of its 18A node aimed at boosting performance and reducing power consumption. The 18A-P process delivers a 9% performance gain at the same power level or an 18% power reduction at the same performance, while als

SK hynix unveiled its innovative iHBM (Integrated High Bandwidth Memory) technology on May 26, 2026, addressing a persistent performance bottleneck in high-bandwidth memory (HBM) used in AI data centers. By embedding proprietary cooling elements directly within the HBM package at the die-to-die phys

SK hynix announced its innovative iHBM (Integrated High Bandwidth Memory) technology on May 26, 2026, which reduces thermal resistance by over 30% by embedding proprietary cooling elements directly within the HBM package. This breakthrough addresses persistent heat buildup in AI data center hardware