Semiconductor News & Analysis Feed
177 articles
2026-07-10
markets.chroniclejournal.com
2026-07-10
The Chronicle-Journal
2026-07-10
bioengineer.org
2026-07-10
Bioengineer.org
2026-07-09
www.digitimes.com
2026-07-09
digitimes
Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early as 2026, potentially on the Taiwan Innovation Board. While Liu did not identify the company, industry observers believe the...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time
2026-07-09
digitimes.com
2026-07-09
Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early as 2026, potentially on the Taiwan Innovation Board. While Liu did not identify the company, industry observers believe the most likely candidate is Socle Technology Corp (Socle).
2026-07-09
digitimes.com
2026-07-09
Memory module maker Team Group reported a June 2026 consolidated revenue of NT$3.0 billion (US$94.2 million), up 18.1% from May and 35.0% from a year earlier. The Taiwan-based company also said that its first-half revenue for the year reached NT$16.6 billion, a record for the period, as demand from the industrial and system integration (SI) sectors stayed firm.
2026-07-08
www.nature.com
2026-07-08
Nature
Article
Published: 08 July 2026
Reconfigurable mmWave microchips co-integrating hBN switches on GaN
Sebastian Pazos, Andrés Fontana, Yaqing Shen, Yue Yuan, Yiyang Yu, Atif Shamim, Dimitra Psychogiou & Mario Lanza
Nature (2026) Cite this article
Save article
1759 Accesses
7 Altmetric
Metrics
details
Abstract
Monolithic microwave integrated circuits (MMICs) are an emerging technology that is
2026-07-07
digitimes.com
2026-07-07
Broadcom has extended its custom chip supply agreement with Apple through 2031, strengthening a key supplier tie that could shape wireless connectivity, AI infrastructure, and device design for years. The move offers investors greater visibility, while global consumers may ultimately see faster, more integrated Apple hardware and network performance.
2026-07-06
digitimes.com
2026-07-06
Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.
2026-07-05
www.digitimes.com
2026-07-05
digitimes
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time
2026-07-05
digitimes.com
2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-04
digitimes.com
2026-07-04
China Resources Microelectronics (CR Micro), a Chinese power semiconductor integrated device manufacturer, has notified customers and partners that it will raise prices across its entire product lineup starting July 1, with increases beginning at 15%.
2026-07-03
news.google.com
2026-07-03
Engineer Live
2026-07-02
digitimes.com
2026-07-02
LG Electronics has begun offering application-specific integrated circuit (ASIC) design services to outside chip companies, drawing on system-on-chip (SoC) development work the company has done for its own products since the early 2000s, according to industry sources cited by ZDNet Korea. LG declined to confirm the report when contacted.
2026-07-02
eetimes.com
2026-07-02
AI has outgrown traditional chips. The future belongs to integrated systems that stack compute, memory, photonics, and power, and HLSI is driving the shift.
2026-07-02
securitytoday.com
2026-07-02
Security Today
The biometrics company added advanced GPUs to boost model training and expand cloud computing resources.
A biometrics and deep learning company has acquired advanced graphics processors to expand its artificial intelligence research and enterprise capabilities.
Neurotechnology integrated NVIDIA Blackwell Ultra B300 accelerators into its existing infrastructure to handle large-scale data processi
2026-07-01
www.securitysales.com
2026-07-01
Security Sales & Integration
SAN MATEO, Calif. — Artificial intelligence-powered physical security and operations provider Verkada, today announces a collaboration with NVIDIA to “accelerate the development and deployment of physical AI across the built environment.”
NVIDIA also joins as a new investor in Verkada, following a strategic investment from Alphabet’s CapitalG at the end of last year.
Verkada is “applying AI to
2026-07-01
simplywall.st
2026-07-01
simplywall.st
United States/Electronic Equipment and Components/NYSE:KEYS
Integrated GaN MMIC Design Breakthrough Might Change The Case For Investing In Keysight Technologies (KEYS)
July 01, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
Share
Copy Link
On 30 June 2026, WIN Semiconductors and Keysight Technologies announced a joint GaN MMIC design workflow that links on-chip simulations, 3D layout checks, and
2026-07-01
stockstory.org
2026-07-01
StockStory
__fail__
2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found
2026-06-30
www.nature.com
2026-06-30
Nature
Article
Open access
Published: 30 June 2026
AlGaN/GaN HEMT H₂ sensor with integrated Wheatstone bridge and on-chip microheater for 0.1-ppm detection
Yu Yu, Yan Liu, Wenbin Ren, Yunpeng Liu, Yulong Zhang, Zihan Wang, Qiming Zhuo, Zewen Liu, Tao Wang & Jianwen Sun
Microsystems & Nanoengineering
volume
12, Article number: 249 (2026) Cite this article
Save article
984 Accesses
Metrics
details