Semiconductor News & Analysis Feed
536 articles
2026-05-28
digitimes.com
2026-05-28
Qualcomm has reportedly landed more than one ASIC customer, with a separate project for a US cloud service provider also taking shape, according to industry sources. The development follows reports from Bloombergand other media that ByteDance, the developer of TikTok, is Qualcomm's first major client for its custom chip push.
2026-05-28
www.manufacturing.net
2026-05-28
Manufacturing.net
www.manufacturing.net
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2026-05-28
news.google.com
2026-05-28
EDN - Voice of the Engineer
2026-05-27
www.theregister.com
2026-05-27
The Register
AI+ML
Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire
Third-gen chips to use Broadzilla's advanced packaging, networking tech
Tobias Mann
Systems editor
0
Published Wed 27 May 2026 // 13:00 UTC
Broadcom has added FuriosaAI to its list of partners building AI accelerators atop its chip packaging tech.
After years quietly serving as the connective tissue behind many modern
2026-05-27
tomshardware.com
2026-05-27
Mark Tyson
A deep tech startup has come out of stealth brandishing a prototype of what it claims to be 'the world’s first fluid circuit board.'
2026-05-27
www.alternativeswatch.com
2026-05-27
Alternatives Watch
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2026-05-27
sammyguru.com
2026-05-27
SammyGuru
Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology.
In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Un
2026-05-27
www.trendforce.com
2026-05-27
TrendForce
[News] TSMC Reportedly Eyes Up to 15% 3nm Price Hike in 2H26, Further 5%–10% Seen in 2027 Amid AI, ASIC Demand
2026-05-27 Semiconductors editor
News
Please note that this article cites information from Commercial Times, Liberty Times, and UDN News.
AI continues to drive tightness in advanced process capacity at TSMC. According to Commercial Times, citing sources, TSMC is expected to rais
2026-05-27
www.newelectronics.co.uk
2026-05-27
New Electronics
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Neil Tyler
27 May 2026
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement...
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2026-05-27
www.bisinfotech.com
2026-05-27
Bisinfotech
www.bisinfotech.com
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2026-05-27
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2026-05-27
EQS News
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2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English
VOM NACHRICHTENDIENST
USI
27 Mai, 2026, 05:00 GMT
ARTIKEL TEILEN
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
www.moomoo.com
2026-05-27
Moomoo
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May 27th - The industry of $Power semiconductor (LIST24211.HK)$ is trending higher today with 8 constituents up an
2026-05-27
www.thailand-business-news.com
2026-05-27
Thailand Business News
www.thailand-business-news.com
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2026-05-27
digitimes.com
2026-05-27
The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.
2026-05-27
digitimes.com
2026-05-27
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption.
2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb