Semiconductor News & Analysis Feed

16 articles
2026-07-19
www.indexbox.io 2026-07-19
2026-07-17
digitimes.com 2026-07-17
2026-07-11
www.eenewseurope.com 2026-07-11
2026-07-06
news.google.com 2026-07-06
2026-07-01
247wallst.com 2026-07-01
This article analyzes how AMD CEO Lisa Su is positioning her company to challenge NVIDIA's market dominance in the data center chip segment. The analysis highlights that as AI and cloud computing demand surge, the data center chip market has become the core battlefield in the semiconductor industry.
2026-06-21
wccftech.com 2026-06-21
Despite Samsung's advancements in advanced lithography, the upcoming Exynos 2700 faces competitive pressure from TSMC's 2nm N2P process. Although Samsung's 2nm GAA process is progressing, rumors suggest it lags behind TSMC’s in terms of Power, Performance, and Area (PPA) metrics. To compensate, Sams
2026-06-18
digitimes.com 2026-06-18
2026-06-16
www.djournal.com 2026-06-16
NVIDIA CEO Jensen Huang expressed confidence in AI's potential to revitalize U.S. manufacturing during a groundbreaking ceremony for a new factory in Sherman, Texas. His remarks underscore the growing belief that AI technologies can drive job creation and innovation in traditional manufacturing sect
2026-06-10
www.manilatimes.net 2026-06-10
ROHM has launched a new TSC3PAK package for SiC MOSFETs, featuring a top-side cooling design that enables automated mounting while matching the heat dissipation performance of conventional through-hole packages like TO-247-4L. This innovation is particularly significant for electric vehicle applicat
2026-06-09
digitimes.com 2026-06-09
2026-06-08
news.google.com 2026-06-08
2026-06-03
tomshardware.com 2026-06-03
Noctua unveiled an improved prototype of its passive thermosiphon liquid cooling solution at Computex 2026, aiming to enhance CPU thermal performance. The thermosiphon operates on a simple principle: a working fluid changes phase from liquid to gas upon heating, condenses in a cooler, and returns to
2026-05-20
eetimes.com 2026-05-20
As AI models become a key driver of global competitiveness, AI hardware for training and inference is increasingly treated as a strategic asset rather than a commodity. In response, Europe is striving to build a sovereign AI platform to reduce reliance on foreign suppliers. SiPearl and Semidynamics
2026-05-15
www.fxleaders.com 2026-05-15
2026-05-13
www.stocktitan.net 2026-05-13
2026-04-17
eetimes.com 2026-04-17
The European High-Performance Computing Joint Undertaking (EuroHPC JU) and the Digital Autonomy with RISC-V in Europe (DARE) consortium are grappling with significant disruptions following Codasip's strategic realignment. Codasip, a key partner in the DARE project, has divested its low-end RISC-V pr