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2026-06-16
www.cnbc.com
2026-06-16
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2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world's first 8nm-class MRAM at an international conference.
2026-06-12
digitimes.com
2026-06-12
India's official think tank NITI Aayog has outlined a 2035 roadmap for India to become a more central part of the global semiconductor industry, warning that continued reliance on imports leaves the country exposed to cost, supply, and security risks.
2026-06-11
www.trendforce.com
2026-06-11
TrendForce
[News] SK hynix Advances DRAM and NAND Roadmap, Targets 3x Wafer Output by 2034, 375-Layer NAND at Year-End
2026-06-11 Semiconductors editor
News
Please note that this article cites information from Nikkei, The Elec, Newsis, Hankyung, and Global Economic.
While SK hynix had only last week outlined plans to double capacity over the next five years, the memory giant is now signaling an eve
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks
Features
By Anton Shilov published 4 hours ago
TSMC kicks off unprecedented capacity expansion plan.
(Image credit: Getty Images / Jimmy Beunardeau)
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Newslette
2026-06-04
news.google.com
2026-06-04
MacDailyNews
2026-06-03
eetimes.com
2026-06-03
Low-power memory has evolved from its mobile device roots to meet the demands of AI data centers.
2026-06-03
tomshardware.com
2026-06-03
Andrew E. Freedman
Microsoft's Majorana 2 quantum computing chip switches to lead-based materials. Microsoft is accelerating its roadmap and expects a practical machine in 2029.
2026-06-01
www.tomshardware.com
2026-06-01
Tom's Hardware
PC Components CPUs
Nvidia lays out RTX Spark roadmap for laptops and desktop PCs at Computex 2026 — three generations outlined, Rubin with LPDDR6 memory, followed by Rosa Feynman
News
By Jeffrey Kampman published 1 June 2026
Nvidia is fully committed to transforming Windows on Arm into an agentic AI platform
(Image credit: Future)
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2026-06-01
tomshardware.com
2026-06-01
Jeffrey Kampman
Nvidia is fully committed to transforming Windows on Arm into an agentic AI platform
2026-05-29
tomshardware.com
2026-05-29
Brandon Hill
TP-Link announced today the roadmap for its next-generation platform of Wi-Fi 8 (802.11bn) products.
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
digitimes.com
2026-05-28
Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that AI infrastructure is shifting from compute-centric bottlenecks toward networking-driven architectures. The company's expanded interconnect portfolio, new silicon photonics acquisition, and emerging scale-up switch progr
2026-05-28
digitimes.com
2026-05-28
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
2026-05-26
carnewschina.com
2026-05-26
CarNewsChina.com
__fail__
2026-05-26
news.futunn.com
2026-05-26
富途牛牛
Unity Software(U.US) reported fourth-quarter financial results after the market close on Monday. Here's a rundown of the report.Q4 Earnings: Unity said fourth-quarter revenue increased 35% year-over-year to $609 million, beating the consensus estimate of $562.71 million. The company reported a quarterly loss of 66 cents per share.
Due to copyright issues, news from Dow Jones is temporarily unavai
2026-05-26
digitimes.com
2026-05-26
Huawei has released itsData Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era.
2026-05-25
www.digitimes.com
2026-05-25
digitimes
HiSilicon president and Huawei Technologies director He Tingbo. Credit: Xinhua
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor...
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