Semiconductor News & Analysis Feed

2388 articles
2026-06-09
digitimes.com 2026-06-09
After concluding a meeting with SK Group on the morning of June 8, Nvidia CEO Jensen Huang traveled to LG Group's headquarters, the LG Twin Towers in Seoul's Yeouido district, for a formal meeting with LG Chairman Koo Kwang-mo. The discussions underscored a widening strategic partnership between the two companies across robotics, AI infrastructure, mobility technologies, and advanced AI developmen
2026-06-09
digitimes.com 2026-06-09
Tencent is sharpening a dual-track AI chip strategy, combining self-developed semiconductors for its own business workloads with deeper partnerships across China's domestic AI computing supply chain.
2026-06-09
digitimes.com 2026-06-09
AMD said on June 8 it plans to invest up to GBP2 billion (approx. US$2.67 billion) in the UK over the next five years to accelerate AI innovation and research and broaden access to advanced computing resources. The company said the funding is intended to support long-term economic growth and scientific leadership nationwide.
2026-06-09
digitimes.com 2026-06-09
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
2026-06-09
digitimes.com 2026-06-09
Nvidia and Hyundai Motor Group have agreed to deepen their collaboration in artificial intelligence, robotics, and future mobility technologies as the two companies seek to accelerate the commercialization of physical AI and expand South Korea's role in next-generation AI infrastructure.
2026-06-09
digitimes.com 2026-06-09
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026. Its earlier investment in US silicon photonics firm Skorpios and the acquisition of Pingood Enterprise also form part of the group's co-packaged optics (CPO) strategy.
2026-06-09
www.01net.it 2026-06-09 01net
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2026-06-09
www.thelec.net 2026-06-09 thelec.net
Samsung Electronics DS Division Head and Vice Chairman Jun Young-hyun holds a press briefing at the Shilla Hotel banquet hall in Seoul's Jangchung-dong district on June 8. (Photo: THE ELEC) Samsung Electronics expressed confidence in its long-term partnership with Nvidia despite the chip designer's increasingly close relationship with SK hynix. Jun Young-hyun, vice chairman and head of Samsung E
2026-06-09
www.asdnews.com 2026-06-09 ASDNews
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2026-06-09
www.msn.com 2026-06-09 MSN
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2026-06-09
www.moomoo.com 2026-06-09 Moomoo
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2026-06-09
www.tradingview.com 2026-06-09 TradingView
News / Reuters / Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs RefinitivLess than 1 min read CDNS +4.80% © Copyright Thomson Reuters 2026. Click For Restrictions - https://agency.reuters.com/en/copyri
2026-06-09
au.investing.com 2026-06-09 Investing.com Australia
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2026-06-09
www.investing.com 2026-06-09 Investing.com
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2026-06-09
in.investing.com 2026-06-09 Investing.com India
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2026-06-09
ca.investing.com 2026-06-09 Investing.com Canada
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2026-06-09
news.google.com 2026-06-09 Sempra
2026-06-09
au.finance.yahoo.com 2026-06-09 Yahoo Finance Australia
This is a paid press release. Contact the press release distributor directly with any enquiries. Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs Business Wire Mon 8 June 2026 at 1:15 pm GMT-7 2 min read INTC +11.19% CDNS +4.80% Expanded cooperation spans DTCO, IP readiness and design enablement to advance next-generation c
2026-06-09
www.mycarrollcountynews.com 2026-06-09 Carroll County Mirror-Democrat
Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications 49 mins ago Facebook Twitter Email Facebook Twitter Email Print Copy article link Save Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia
2026-06-09
www.lincolnjournal.com 2026-06-09 lincolnjournal.com
Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs 42 mins ago Facebook Twitter Email LINCOLN COUNTY’S TRUSTED NEWS SOURCE. Click here to stay informed and subscribe to the The Lincoln Journal. Click #isupportlocal for more information on supporting our local journalists. Facebook Twitter Email Print Copy article link Save