SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

Driven by the rapid expansion of AI, cloud computing, and advanced telecommunications, demand for faster and more efficient data transfer is propelling silicon photonics from a niche research area to a central component of mainstream semiconductor supply chains. Once considered a long-term technolog

Silicon photonics Semiconductor supply chain AI infrastructure Data center Optical interconnect Wafer manufacturing Semiconductor industry trends Optical communication

Anthropic signs a $35B AI compute deal with $NVIDIA (NVDA.US)$ backed Lambda. $Hut 8 (HUT.US)$ / DC, with Lambda / GPUs. Frontier model demand is rapidly outpacing the ecosystem's ability to build capacity. It also looks like Anthropic is securing mor - Moomoo

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www.moomoo.com 2026-09-01

Rapidus' IIM-1 Fab Construction is Completed. Will Cadence Make It the First Agentic Foundry? - The Futurum Group

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news.google.com 2026-08-31

Qualcomm vs. Sandisk: Comparing Gradual Revenue Contraction Against Rapid Revenue Acceleration - Currently.com

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news.google.com 2026-08-31

Qualcomm vs. Sandisk: Comparing Gradual Revenue Contraction Against Rapid Revenue Acceleration - The Motley Fool

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news.google.com 2026-08-31

How Rapidus Is Attempting 2nm Chips With Zero Mass-Production Experience - XenoSpectrum

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xenospectrum.com 2026-08-29

Rapidus is attempting to develop 2nm chips without any mass-production experience, sparking widespread skepticism. Despite never operating a semiconductor fabrication line, the company aims to compete with industry leaders like TSMC, Samsung, and Intel at the cutting-edge 2nm node. This ambitious pl

Semiconductor Manufacturing 2nm Process Japan Semiconductor Industry Government Support Rapidus TSMC Technology Transfer Industrial Policy

Nvidia sales soar on rapid buildout of AI data centres - BBC

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www.bbc.com 2026-08-27

Diamond Rapids Is Not Just a 256-Core CPU — Intel Is Turning Xeon Into a Chiplet System - semivision

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tspasemiconductor.substack.com 2026-08-26

Intel Deep Dives 256-Core Diamond Rapids With 16 Core Chiplets & Huge Cache - HotHardware

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hothardware.com 2026-08-25

Intel unveiled its next-generation Xeon 7 Diamond Rapids processor at Hot Chips 2026, featuring a revolutionary chiplet-based architecture with up to 256 performance cores and 1.28GB of shared L3 cache. The design uses 16 compute chiplets fabricated on the 18A-P process node, stacked vertically usin

Intel Xeon 7 Diamond Rapids chiplet architecture 3D packaging cache hierarchy AI workloads data center CPU

Specifications for the Intel Diamond Rapids Xeon Processor Reveal It Has 256 P-Cores Using a 16-Chiplet Design Paired with 1.28GB of Last-Level Cache - The FPS Review

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www.thefpsreview.com 2026-08-25

[News] Intel Unveils Three AI Architectures at Hot Chips 2026, Diamond Rapids Taps In-House 18A-P and Advanced Packaging - TrendForce

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www.trendforce.com 2026-08-25

Intel pitches Diamond Rapids at Hot Chips as server CPU competition heats up

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digitimes.com 2026-08-25

Rapidus expands advanced packaging plans, aims for larger interposers by 2030 - New Electronics

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www.newelectronics.co.uk 2026-08-24

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