Semiconductor News & Analysis Feed

627 articles
2026-06-25
tomshardware.com 2026-06-25 Jowi Morales
Gamers and enthusiasts just can’t catch a break from the memory chip shortage.
2026-06-25
www.businesskorea.co.kr 2026-06-25 Businesskorea
Samsung held first place in global DRAM revenue share at 38% in Q1, while SK hynix fell to 29% Samsung Electronics' DDR5 DRAM. (Photo provided by Samsung Electronics) Samsung Electronics maintained its leading position in the DRAM market for two consecutive quarters. This is interpreted as the result of significantly increasing production capacity in response to the memory shortage triggered by b
2026-06-25
eetimes.com 2026-06-25
IBM unveils 0.7-nm nanostack chips promising 100 billion transistors, denser SRAM, and production within five years.
2026-06-25
www.tomshardware.com 2026-06-25 Tom's Hardware
Tech Industry Artificial Intelligence Qualcomm reveals HBC near-memory AI architecture, AI250 and AI350 accelerators — touts 6x higher bandwidth-per-watt compared to HBM, 200x capacity compared to on-chip SRAM News By Anton Shilov published 22 hours ago More efficient than HBM, denser than SRAM. Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall. (Image credi
2026-06-25
seekingalpha.com 2026-06-25 Seeking Alpha
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2026-06-25
en.sedaily.com 2026-06-25 Seoul Economic Daily
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2026-06-25
www.investing.com 2026-06-25 Investing.com
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2026-06-25
news.futunn.com 2026-06-25 富途牛牛
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2026-06-25
biz.chosun.com 2026-06-25 Chosunbiz
By  Jeong Du-yong Published 2026.06.25. 12:34 Global DRAM market share trend. /Courtesy of Counterpoint Research In the global memory market, Samsung Electronics kept the No. 1 spot in DRAM and NAND flash. SK hynix maintained the lead in the high bandwidth memory (HBM) market with a majority share. Chinese companies increased their shares in DRAM and NAND, speeding up the chase. According to mem
2026-06-25
digitimes.com 2026-06-25
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
2026-06-25
digitimes.com 2026-06-25
Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments and a clearer path to shareholder returns.
2026-06-25
digitimes.com 2026-06-25
Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process has entered stable mass production while its Wuxi 12-inch line continues to ramp.
2026-06-25
wccftech.com 2026-06-25 Wccftech
Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall. At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted
2026-06-24
simplywall.st 2026-06-24 simplywall.st
United States/Semiconductors/NasdaqGS:INTC Can Intel’s New Foundry Chief Reframe INTC’s Role in Advanced Packaging and AI Supply Chains? June 24, 2026 Simply Wall St Reviewed by Sasha Jovanovic Share Copy Link Earlier this month, Intel appointed former SK hynix and SK On chief Seok-Hee Lee as executive vice president of Intel Foundry, putting him in charge of advanced packaging, system integration
2026-06-24
finance.yahoo.com 2026-06-24 Yahoo Finance
SK Hynix Targets $29B Nasdaq Offering – DRAM Jumps Over 4% Ahead Of Micron's Report SK Hynix Targets $29B Nasdaq Offering – DRAM Jumps Over 4% Ahead Of Micron's Report · Stocktwits Yuvraj Malik Wed, June 24, 2026 at 3:03 AM PDT 2 min read 000660.KS +0.98% MU -1.12% Trade MU on Coinbase Trading disclosure SK Hynix will issue 17.79 million new shares to back a Nasdaq listing of ADRs on July 10. DR
2026-06-24
tomshardware.com 2026-06-24 Etiido Uko
Meta has paused an internal AI training program after employee conversations, keystrokes, transcripts, and performance-related data were reportedly exposed across the company.
2026-06-24
www.moomoo.com 2026-06-24 Moomoo
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2026-06-24
www.ad-hoc-news.de 2026-06-24 Ad-hoc-news.de
Ams, Osram Ams Osram Secures €1bn Bond to Halve Financing Costs as €570m Infineon Sale Hangs in Regulatory Balance 24.06.2026 - 03:15:47 | boerse-global.de Ams Osram places €1B bond at 7.25% to cut annual interest costs by €40M, eyes Infineon sensor sale for deleveraging; stock up 134% YTD but recent volatility persists. Ams - Ams Osram Secures €1bn Bond to Halve Financing Costs as €570m Infineo
2026-06-24
digitimes.com 2026-06-24
Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens beyond high-bandwidth memory, or HBM, into server DRAM and storage products.
2026-06-24
digitimes.com 2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.