Semiconductor News & Analysis Feed

115 articles
2026-06-15
digitimes.com 2026-06-15
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i
2026-06-15
digitimes.com 2026-06-15
Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging technology markets.
2026-06-15
www.digitaltrends.com 2026-06-15 Digital Trends
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company is developing a new Chip-on-Panel-on-Substrate, or CoPoS, technology that promises lower manufacturing costs while delivering better performance for future AI processors. TSMC’s CoPoS packaging coul
2026-06-15
news.google.com 2026-06-15 The Motley Fool
2026-06-14
wccftech.com 2026-06-14 Wccftech
NVIDIA's Blackwell GB300 has posted record performance in AA-AgentPerf, a new benchmark that measures Agentic AI workflows. Artificial Analysis has a new benchmark out called AA-AgentPerf, which measures how many active agents an inference deployment can support under realistic workloads, which include: The AA-AgentPerf benchmark is used to measure three key metrics, which form the basis of mode
2026-06-13
tomshardware.com 2026-06-13 Mark Tyson
A new and unique video streaming solution is pitched as a 'high-performance, real-time ASCII video rendering engine' that can be used to broadcast 'an unblockable video stream.'
2026-06-13
developer.nvidia.com 2026-06-13 NVIDIA Developer
AI agents have fundamentally changed the complexity of inference workloads. Until now, the industry has struggled to define a standard for measuring how inference systems perform under these conditions. Artificial Analysis AgentPerf (AA-AgentPerf) offers the industry’s first multi-vendor open benchmarks profiling trajectories that are representative of real-world AI agent coding tasks.  This post
2026-06-12
www.benzinga.com 2026-06-12 Benzinga
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2026-06-12
digitimes.com 2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com 2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com 2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
digitimes.com 2026-06-12
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related chips, and rising use of advanced packaging capacity. The result suggests continued momentum in global semiconductor supply chains, with implications for networking, memory, and high-performance computing markets worldwide.
2026-06-11
simplywall.st 2026-06-11 simplywall.st
United States/Semiconductors/NasdaqGS:ASML Assessing ASML Holding (NasdaqGS:ASML) Valuation After Strong Recent Share Price Performance June 11, 2026 Simply Wall St Advertisement ASML Holding stock snapshot after recent performance ASML Holding (NasdaqGS:ASML) has drawn fresh attention after a period of strong returns, with the stock up about 11% over the past month and about 28% over the past 3
2026-06-11
digitimes.com 2026-06-11
Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation server memory platforms.
2026-06-11
www.tomshardware.com 2026-06-11 Tom's Hardware
PC Components CPUs AMD fires back at Nvidia, claiming 256-core Zen 6 'Venice' CPU beats Vera by 3.3x in rack-level performance — company shares first estimated EPYC Venice benchmarks News By Jake Roach published 4 hours ago Mind the footnotes on this one. (Image credit: AMD) Share this article 2 Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our n
2026-06-11
tomshardware.com 2026-06-11 Jake Roach
AMD has shared the first official results for its 256-core EPYC Venice CPU, saying it beats Nvidia's Vera by 3.3x in a rack-level deployment.
2026-06-10
digitimes.com 2026-06-10
WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to NT$1.073 billion (US$33.9 million) in May 2026, the company's second-highest monthly total on record. For global readers tracking the semiconductor supply chain, the results signal how AI infrastructure demand is resha
2026-06-10
digitimes.com 2026-06-10
WD is preparing for a global wave of AI data growth by prioritizing hard drives with higher capacity, faster performance, and lower power consumption. The company says the shift reflects how AI training and inference are generating more data than traditional systems can handle, making storage efficiency and affordability increasingly important worldwide.
2026-06-10
digitimes.com 2026-06-10
GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment in AI infrastructure drove a surge in demand for specialty copper materials used in cooling applications. The firm linked the month's performance to rising cooling needs at servers and data centers as computing density i
2026-06-10
www.eurasiareview.com 2026-06-10 Eurasia Review
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