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2026-06-23
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2026-06-23
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2026-06-23
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2026-06-23
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Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Jun 22, 2026 Updated 1
2026-06-23
sg.finance.yahoo.com
2026-06-23
Yahoo Finance Singapore
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Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Business Wire
Mon, 22 June 2026 at 1:30 pm GMT-7 2 min read
Q
-8.23%
Qnity’s material innovations enable next-generation advanced packaging, showcased through new Innovation Hub
WILMINGTON, Del., June 22, 2026--(BUSINE
2026-06-23
www.marketscreener.com
2026-06-23
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2026-06-23
wccftech.com
2026-06-23
Wccftech
SPHBM4 is a new JEDEC standard that aims to solve the high cost and packaging concerns with existing HBM technologies.
Almost all AI & HPC accelerators rolling out these days feature some form of HBM memory. The highest-end solutions are leveraging the latest HBM4 designs, and HBM4E is being sampled to the top chipmakers.
But as demand continues to rise, and shortages persist in the premium DRAM
2026-06-23
www.abc15.com
2026-06-23
ABC15 Arizona
NEWSBUSINESS
TSMC, Amkor lock in 10-year deal for advanced packaging and test services
You can watch the latest headlines and weather from ABC15 Arizona in Phoenix any time on-air, online, and on the ABC15 mobile and streaming apps.
By: Ethan Holtzinger, Phoenix Business Journal
Posted 1:08 AM, Jun 23, 2026
Two Valley semiconductor giants have formalized a long-planned partnership.
Taiwan Se
2026-06-22
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2026-06-22
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2026-06-22
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2026-06-22
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LPK: Leadership in advanced packaging and LIDE technology drives growth amid ongoing restructuring
LPK: Leadership in advanced packaging and LIDE technology drives growth amid ongoing restructuring
Less than 1 min read
LPK
−6.05%
The conference highlighted leadership in laser-based advanced packaging, with LIDE technology driving defect-free glass structuring for next-gen chips. D
2026-06-22
www.digitimes.com
2026-06-22
digitimes
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO...
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2026-06-22
news.google.com
2026-06-22
Bits&Chips
2026-06-22
www.kucoin.com
2026-06-22
KuCoin
Intel CEO Patrick Gelsinger stated that his return target for Intel is "a 10-fold increase within 5 to 10 years," and he is systematically rebuilding Intel’s technology roadmap around advanced packaging, novel semiconductor materials, and next-generation substrate technologies.
In a recent podcast episode, Chen Liwu detailed his roadmap for transforming Intel: after stabilizing the balance sheet
2026-06-22
digitimes.com
2026-06-22
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO Lip-Bu Tan to reorganize the company's foundry business.
2026-06-22
digitimes.com
2026-06-22
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next several years. Supply chain sources said the first wave of demo equipment has already been installed at VisEra, a TSMC subsidiary.
2026-06-22
digitimes.com
2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-20
economictimes.indiatimes.com
2026-06-20
The Economic Times
Synopsis
Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will lead advanced packaging and system integration efforts, a crucial area for Intel's push into next-generation AI systems. His extensive experience in high-scale technology and manufacturing is expected to bolster Intel's capabilities and customer commitments in this v
2026-06-20
www.aninews.in
2026-06-20
ANI News
Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging
ANI | Updated: Jun 20, 2026 17:01 IST
Seol [South Korea], June 20 (ANI): Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker's push into advanced semiconductor packaging.
According to a report by The Korea Herald, Intel announced Thursd
2026-06-20
www.tekedia.com
2026-06-20
Tekedia
Intel Taps Semiconductor Veteran Seok-Hee Lee To Lead Advanced Packaging Push As Apple Deal Fuels Foundry Ambitions
June 20, 2026 | by Samuel Nwite | 0
Intel has elevated semiconductor industry veteran Seok-Hee Lee to lead its advanced packaging operations, marking the company’s determination to rebuild its manufacturing business and position itself as a major beneficiary of the artificial intel
2026-06-20
www.igorslab.de
2026-06-20
igor´sLAB
INTEL • LATEST NEWS
Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI
20. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,308 words · 8,649 characters
A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone