Semiconductor News & Analysis Feed
430 articles
2026-06-02
www.digitimes.com
2026-06-02
digitimes
Intel's foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging business.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in'
2026-06-02
www.digitimes.com
2026-06-02
digitimes
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges, TSMC, Samsung Electronics, SK Hynix, Micron, and other top semiconductor...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-01
www.deccanherald.com
2026-06-01
Deccan Herald
Bengaluru: Semiconductors are evolving from standalone components into tightly integrated systems that underpin the digital economy. This structural shift presents a timely opportunity for India to leapfrog legacy stages and position itself as a competitive force across critical segments of the global semiconductor supply chain, said NITI Aayog in its report ‘Future of India’s Semiconductor Indust
2026-05-31
www.tekedia.com
2026-05-31
Tekedia
MediaTek Accepts Both Intel And TSMC Packaging As AI Chip Boom Reshapes Semiconductor Supply Chains
May 31, 2026 | by Samuel Nwite | 0
Taiwanese chip designer MediaTek is positioning itself as a rare neutral player in one of the semiconductor industry’s most consequential battles, embracing both Taiwan Semiconductor Manufacturing Co. (TSMC) and Intel’s advanced packaging technologies as demand f
2026-05-31
www.thelec.net
2026-05-31
thelec.net
Solder balls used in semiconductor packaging. (Photo: THE ELEC)
South Korean prosecutors have launched a forced investigation after uncovering allegations that semiconductor packaging material suppliers colluded on pricing and supply volumes.
The Criminal Proceeds Recovery Division of the Seoul Central District Prosecutors' Office, headed by Chief Prosecutor So Jung-soo, began search and seizure
2026-05-31
digitimes.com
2026-05-31
Facing memory shortages and Sharp's plan to shut down its Guishan K2 plant by the end of 2026, GIS chairman Hsien-Ying Chou said the company faces greater operational challenges in the second half of 2026. However, its transformation strategy is accelerating. Among its new businesses, optical waveguide products used in AI glasses and other applications began small-volume shipments in the first qua
2026-05-30
telecom.economictimes.indiatimes.com
2026-05-30
ET Telecom
Read and get insights from specially curated unique stories from editorial
Explore and discuss challenges & trends in India's leading B2B events
Recognise work that not only stood out but was also purposeful
Join leaders & experts for roundtables, conferences, panels and discussions
By continuing you agree to our Privacy Policy & Terms & Conditions
We have various options to advertise with us
2026-05-30
digitimes.com
2026-05-30
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.
2026-05-30
digitimes.com
2026-05-30
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.
2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
seekingalpha.com
2026-05-30
Seeking Alpha
__fail__
2026-05-30
wtvbam.com
2026-05-30
WTVB
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-29
www.tradingview.com
2026-05-29
TradingView
__fail__
2026-05-29
www.zacks.com
2026-05-29
Zacks Investment Research
__fail__
2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker is hedging its bets with a dual packaging strategy as AI demand strains TSMC's capacity.
2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker's dual-sourcing strategy for AI silicon reflects both soaring demand and real capacity bottlenecks at TSMC.
2026-05-29
wkzo.com
2026-05-29
WKZO
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-29
finimize.com
2026-05-29
Finimize
The chip designer says it supports both TSMC’s CoWoS and Intel’s EMIB as it targets $2 billion of 2026 data center revenue.
MediaTek, a Taiwanese chip designer best known for smartphone processors, says it can package custom AI data-center chips using either TSMC’s CoWoS or Intel’s EMIB, giving customers two routes to get to mass production.
“Advanced packaging” is the step that connects multipl
2026-05-29
www.thestar.com.my
2026-05-29
thestar.com.my
__fail__
2026-05-29
www.reuters.com
2026-05-29
Reuters
__fail__