Taiwan’s MediaTek says it supports both TSMC and Intel’s advanced packaging technologies - WTVB

MediaTek announced that it supports both TSMC’s and Intel’s advanced packaging technologies, enabling customers to choose between them. This move underscores MediaTek’s strategic positioning in the cu... Read original →

MediaTek’s dual support for TSMC’s CoWoS and Intel’s EMIB isn’t technical neutrality—it’s a geopolitical hedge. This forces EDA vendors to maintain dual packaging standards, empowering clients like Google or NVIDIA to negotiate aggressive pricing. While sourcing 3nm/4nm from TSMC’s Arizona fabs mitigates some U.S. export controls, Intel’s IFS lacks formal clearance for sensitive AI chip production, inflating redundancy costs. Competitors like Qualcomm will likely accelerate in-house packaging to avoid dependency. Over the next 18 months, advanced packaging—not transistor scaling—will bottleneck AI chip delivery. MediaTek’s bet on A14 and dual-sourcing is a calculated play for the $70B+ custom ASIC market by 2027, but yield ramp and cross-platform validation, not announcements, will determine if its $2B data center target holds.