Semiconductor News & Analysis Feed
427 articles
2026-06-26
uk.finance.yahoo.com
2026-06-26
Yahoo Finance UK
2026-06-26
biz.chosun.com
2026-06-26
Chosunbiz
By
Jeong Du-yong
Published 2026.06.26. 10:39
Product image of the new FC Bonder 3.5 for artificial intelligence (AI) system semiconductors from ##HANMI Semiconductor##./Courtesy of ##HANMI Semiconductor##
HANMI Semiconductor said on the 26th it launched new equipment for artificial intelligence (AI) system semiconductors, the "FC Bonder 3.5" (Flip Chip Bonder 3.5). The company plans to supply th
2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.igorslab.de
2026-06-25
igor´sLAB
LATEST NEWS
ASE is building 15 new sites: Advanced Packaging is becoming the next major AI bottleneck
25. June 2026 06:00Samir Bashir
📖 Reading time: approx. 9 minutes · 1,647 words · 10,736 characters
In the case of AI chips, people like to talk about transistors, HBM bandwidth, and compute performance. Eventually, however, the GPU, memory, chiplets, and power supply must actually be assembled i
2026-06-25
www.scmp.com
2026-06-25
South China Morning Post
Semiconductors
Tech
China’s JCET to build new plant in Shanghai to expand advanced chip packaging
US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development
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Xinmei Shen
Published: 8:30am, 25 Jun 2026
Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics
2026-06-25
digitimes.com
2026-06-25
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI servers, and advanced chips are tightening, while new capacity is expected to ease bottlenecks and shape revenue growth in 2026 and 2027.
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
digitimes.com
2026-06-25
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company had built over the past few years was absorbed almost immediately.
2026-06-25
www.indexbox.io
2026-06-25
IndexBox
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2026-06-24
simplywall.st
2026-06-24
simplywall.st
United States/Semiconductors/NasdaqGS:INTC
Can Intel’s New Foundry Chief Reframe INTC’s Role in Advanced Packaging and AI Supply Chains?
June 24, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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Earlier this month, Intel appointed former SK hynix and SK On chief Seok-Hee Lee as executive vice president of Intel Foundry, putting him in charge of advanced packaging, system integration
2026-06-24
www.insidermonkey.com
2026-06-24
Insider Monkey
NEWS
Intel (INTC) Advanced Packaging Could Support AI Data Center Growth, Mizuho Says
Published on June 24, 2026 at 9:47 am by GHAZAL AHMED in News
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Intel (NASDAQ:INTC) is one of the 15 AI Stocks Analysts Are Watching: Microsoft, Nvidia, and More.
Intel Corporation may benefit from tailwinds coming from advanced packaging technologies, which has led one firm to raise estimates and its price
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
Intel (INTC) Advanced Packaging Could Support AI Data Center Growth, Mizuho Says
Ghazal Ahmed
Wed, June 24, 2026 at 6:47 AM PDT 2 min read
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Intel (NASDAQ:INTC) is one of the 15 AI Stocks Analysts Are Watching: Microsoft, Nvidia, and More.
Intel Corporation may benefit from tailwinds coming from advanc
2026-06-24
evertiq.com
2026-06-24
Evertiq
© tsmc
Business | June 24, 2026
TSMC partners with Amkor to accelerate advanced packaging in US
Evertiq
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
TSMC and Amkor Technology have annou
2026-06-24
digitimes.com
2026-06-24
South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments, as the two chipmakers review plans that could include front-end fabrication plants and packaging facilities across the country's Honam and Chungcheong regions. Both companies say no final decisions have been made.
2026-06-24
digitimes.com
2026-06-24
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
2026-06-24
digitimes.com
2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.