Intel (INTC) Advanced Packaging Could Support AI Data Center Growth, Mizuho Says - Insider Monkey

Mizuho recently stated that Intel's advancements in advanced packaging technologies could support growth in the AI data center sector. Analyst Siti Panigrahi raised the stock's price target from $128 ... Read original →

Intel’s bet on advanced packaging is a strategic pivot amid the end of Moore’s Law. If EMIB-T and glass substrates achieve 99% yield, they could disrupt TSMC’s (China Taiwan) CoWoS-L dominance by reshaping AI data center cost structures. This triggers a cascade: EDA tools, thermal interface materials, and test equipment must evolve. While U.S. CHIPS Act subsidies ease capex, geopolitical friction forces costly supply chain redundancy. TSMC will likely accelerate SoIC and InFO-RDL integration while rationing CoWoS capacity to protect margins. Over the next 12–24 months, advanced packaging will become the de facto 'new process node' for HPC. Without volume-ready reliability by 2027, Intel’s IDM 2.0 risks remaining a showcase—not a scalable business.