Intel (INTC) Advanced Packaging Could Support AI Data Center Growth, Mizuho Says - Yahoo Finance

Mizuho analysts believe that Intel's advancements in advanced packaging technologies could support growth in the AI data center segment. On June 22, the firm raised Intel's price target from $128 to $... Read original →

Intel’s progress in EMIB-T and glass-based advanced packaging isn't just incremental—it threatens to disrupt the AI data center supply chain by offering a cost-competitive alternative to TSMC’s CoWoS-L. Achieving ~99% yield would erode TSMC’s pricing power and accelerate industry-wide adoption of heterogeneous integration. Upstream, glass substrate suppliers face surging demand but must meet extreme thermal and wiring specs; downstream, Microsoft and other hyperscalers could leverage Intel’s tech to diversify away from the NVIDIA-TSMC duopoly. Geopolitically, advanced packaging offers a partial workaround to sub-7nm export controls, yet high-precision bonding tools remain under U.S./EU jurisdiction, capping supply chain autonomy. Within 18 months, packaging will define AI chip competitiveness—Intel must scale production by mid-2027 or risk becoming a fallback option rather than a strategic pillar.