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EUV61 3nm57 AI45 AI chips40 GPU37 AI infrastructure30 DRAM21 HBM17 semiconductor15 AI computing15 memory chips13 data center12
2026-08-20
High-end PCB supply tightens as CCL expansions face delays
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digitimes.com 2026-08-20
2026-08-03
AI infrastructure orders extend PCB expansion race
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digitimes.com 2026-08-03
2026-08-03
Flexible PCB maker Flexium sees AI server shipments doubling after 2Q margin turns positive
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digitimes.com 2026-08-03
2026-08-02
Cadence Launches AuraStack AI Super Agent For PCB And Packaging Design - Pokde.Net
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pokde.net 2026-08-02
2026-07-31
Cadence releases new AuraStack AI Super Agent dedicated to PCB and packaging design - My Everyday Tech
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www.myeverydaytech.com 2026-07-31
Cadence has launched its new AuraStack AI Super Agent, tailored for PCB and advanced packaging design. Built on an AI-native platform, it streamlines the entire design cycle from system planning to final product realization. Powered by NVIDIA Blackwell and CUDA-X, the platform coordinates domain-spe
CadenceAI Super AgentPCB DesignPackaging DesignNVIDIA BlackwellCUDA-XSystem DesignMultiphysics Analysis
2026-07-31
Cadence brings agentic AI to PCB and advanced packaging design with AuraStack AI Super Agent - Tech Critter
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www.tech-critter.com 2026-07-31
Cadence introduces AuraStack AI Super Agent, the world’s first agentic AI platform tailored for PCB and advanced packaging design, integrated into Allegro AI Studio. This AI-native solution leverages NVIDIA Blackwell and CUDA-X acceleration to orchestrate multiple domain-specific agents across plann
AI chip designPCB designadvanced packagingCadenceNVIDIAagentic AIEDA toolsdesign workflow
2026-07-30
AI platform unifies PCB, advanced packaging workflows - EDN - Voice of the Engineer
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news.google.com 2026-07-30
2026-07-27
Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design - TechPowerUp
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news.google.com 2026-07-27
2026-07-27
Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design - PR Newswire
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news.google.com 2026-07-27
2026-07-27
ZDT-led China PCB expansion tops US$10 billion on AI server and edge AI demand
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digitimes.com 2026-07-27
2026-07-24
Zhen Ding expands Thailand capacity, deepens industry-academia ties to develop PCB, chip talent
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digitimes.com 2026-07-24
2026-07-22
Cadence Launches AuraStack AI Super Agent for PCB Design, Advanced Packaging - EE Times India
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news.google.com 2026-07-22
2026-07-22
Cadence Launches AuraStack AI Super Agent for PCB Design, Advanced Packaging - EE Times Asia
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news.google.com 2026-07-22
2026-07-20
Agentic AI platform for PCB and packaging - Electronics Weekly
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www.electronicsweekly.com 2026-07-20
2026-07-20
AI boom pushes PCB, passive component lead times into a new normal
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digitimes.com 2026-07-20
2026-07-20
Compeq acquires Guanyin site for NT$2.09 billion to expand optical and space data center PCB capacity
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digitimes.com 2026-07-20
2026-07-17
Cadence Unveils AuraStack AI Super Agent for PCB - PlasticsToday
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www.plasticstoday.com 2026-07-17
2026-07-17
Cadence launches AI platform for PCB and advanced packaging design - New Electronics
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www.newelectronics.co.uk 2026-07-17
2026-07-16
Cadence’s AuraStack AI Stack Addresses The PCB & Advanced Packaging Bottleneck That Is Eating 65% Of Engineers’ Time, With NVIDIA & TSMC Already Deploying It - Wccftech
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wccftech.com 2026-07-16
2026-07-16
Cadence launches AuraStack AI for natural language PCB packaging design - NewsBytes
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www.newsbytesapp.com 2026-07-16