AI infrastructure orders extend PCB expansion race

The surge in demand for AI infrastructure is triggering a full-scale expansion across the PCB supply chain, with upstream copper-clad laminates already in short supply, signaling rapid supply chain restructuring. Technologically, PCB design is shifting toward high-density interconnect and high-frequency performance, pushing CCL materials to evolve. Geopolitical tensions are increasing supply chain risks, especially with restrictions on key equipment and materials, forcing companies to prioritize localization and diversification. In market dynamics, leading firms are accelerating capital investment to secure production capacity, pressuring mid-sized players. Over the next 12-24 months, this expansion will drive price increases across the entire chain—materials, equipment, and design tools—while accelerating domestic substitution, creating a synergistic effect of 'technology-capital-policy'.