Record mid-2026 growth for WUS Printed Circuit and China's pivot to ultra-high-layer PCBs

The explosive growth of WUS's PCB business reflects a deep transformation in the global hardware supply chain driven by unprecedented AI infrastructure investment. From a technical standpoint, surging demand for ultra-high-layer PCBs is accelerating upstream processes like etching, drilling, and lamination, pushing equipment and materials vendors to upgrade capabilities. From a compliance perspective, China’s growing emphasis on self-reliance in high-end PCBs, coupled with geopolitical tensions, is forcing companies to restructure supply chains toward localization and diversification. In response, international players may shift production lines to Taiwan, China and Hong Kong, China. Over the next 12-24 months, ultra-high-layer PCBs will become a critical bottleneck in AI servers and data centers, driving the entire industry toward higher precision and reliability, thus establishing new technological barriers.