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AMD's addition of UCIe support to Versal adaptive SoCs represents a significant advancement in semiconductor architecture, positioning the company for enhanced performance in AI and high-performance computing applications. The Versal platform, already established in data centers, 5G communications,

AMD Chiplet UCIe Versal Adaptive SoC Semiconductor Technology Chip Design Interconnect Standard

AMD to Bring UCIe Chiplet Connectivity to Versal RF Adaptive SoCs - All About Circuits

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www.allaboutcircuits.com 2026-09-03

AMD's integration of UCIe chiplet connectivity into its Versal RF adaptive SoC represents a significant advancement in semiconductor interconnect architecture. UCIe (Universal Chiplet Interconnect Express), an open chiplet standard, addresses interoperability challenges in traditional chip design by

AMD Chiplet connectivity UCIe Versal RF adaptive SoC Semiconductor technology Chip architecture AI chips

Indian Startup HrdWyr Builds AI-Native SoCs for the Physical World

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eetimes.com 2026-09-02

Indian startup HrdWyr is developing a new class of AI-native system-on-chips (SoCs) tailored for local AI inference in physical systems. Founded in 2023 by Sivakumar Ramamurthy and Guruswamy Ganesh, the company focuses on integrating AI, real-time control, signal processing, and data movement into a

AI-native SoC Semiconductor startup Indian semiconductor AI inference Mixed-signal SoC Battery management Edge computing Reinforcement learning

Jeilin shifts upmarket as high-end image SoCs drive margins higher

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digitimes.com 2026-08-24

TSMC Reportedly Sitting On $1 Billion Worth Of Apple A20 Pro SoCs, Semiconductor Giant Can’t Move To Next Stage Before Adequate DRAM Supply Arrives - Wccftech

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wccftech.com 2026-08-06

Kirin 9030 In-Depth Analysis Proves SMIC Can Create Denser SoCs Than Intel Has With Its 18A Node, But The Attributes That Require Improvements Are Left Out - Wccftech

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wccftech.com 2026-07-21

Post-Quantum Cryptography Incorporated into SoCs via eFPGA

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eetimes.com 2026-07-20

As quantum computing threats grow, post-quantum cryptography (PQC) is becoming a critical component in modern chip designs. This article highlights a collaboration between QuickLogic and PQSecure, integrating PQC IP into embedded FPGA (eFPGA) fabric, enabling SoC designs to update cryptographic func

Post-Quantum Cryptography System-on-Chip Embedded FPGA Hardware Security Cryptographic Algorithms NIST Standards Quantum Computing Threat Reconfigurable Hardware

Amdocs, (DOX), 1Finity, Supermicro (SMCI) Validate AI-RAN Blueprint with NVIDIA (NVDA) Infrastructure - Yahoo Finance

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finance.yahoo.com 2026-07-03

Amdocs (DOX), 1Finity, and Supermicro (SMCI) have validated an AI-RAN blueprint with NVIDIA infrastructure, marking a significant step toward intelligent network operations. This collaboration enables service providers to build a unified, multi-vendor platform that enhances performance, anomaly dete

AI-RAN NVIDIA Network Intelligence Edge Computing 5G Network Autonomous Operations Cloud Computing Artificial Intelligence

Socionext to develop TSMC A14 chiplet for AI data center SoCs - digitimes

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www.digitimes.com 2026-07-02

Socionext's collaboration with TSMC to develop high-performance computing chiplets using A14 process technology represents a significant advancement in AI data center infrastructure. This partnership combines Socionext's chip design expertise with TSMC's advanced manufacturing capabilities, creating

chip design AI data center TSMC chiplet semiconductor artificial intelligence chip manufacturing custom silicon

Socionext to develop TSMC A14 chiplet for AI data center SoCs

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digitimes.com 2026-07-02

Cloud AI squeezes 2nm capacity, pressuring mobile SoCs - digitimes

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www.digitimes.com 2026-07-02

The rapid advancement of cloud AI technology is driving mobile system-on-chip vendors to accelerate their flagship products toward 2nm process nodes, with full implementation expected by 2026. This trend extends beyond performance improvements to avoid the most constrained 3nm process and secure sta

Semiconductor Manufacturing Mobile SoC 2nm Process 3nm Process Capacity Constraints Cloud AI Chip Supply Chain TSMC

Spectre X from Cadence Design Systems - tailored mixed-signal verification for complex SoCs - AD HOC NEWS

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www.ad-hoc-news.de 2026-07-01

Cadence Design Systems has introduced Spectre X, a high-performance mixed-signal simulation engine tailored for advanced-node (7nm and below) SoC design. Designed to enhance verification of analog and RF circuits embedded in modern chips, Spectre X integrates seamlessly into the Cadence Virtuoso pla

Semiconductor Design Tools Mixed-Signal Simulation Advanced Process Nodes EDA Industry Cadence Design Systems SoC Design SPICE Simulation FastSPICE

Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS - digitimes

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www.digitimes.com 2026-06-29

Foxconn's semiconductor packaging subsidiary ShunSin Technology confirms a partnership with TSMC in COUPE (Co-Packaged Optics) technology, marking a significant advancement in Taiwan's semiconductor supply chain toward optical integration. This collaboration accelerates ShunSin's transition to CPO a

Foxconn TSMC ShunSin CPO OCS Semiconductor Packaging Optical Integration Supply Chain

Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS

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digitimes.com 2026-06-29

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