Semiconductor News & Analysis Feed

18 articles
2026-07-08
www.electronicsweekly.com 2026-07-08 Electronics Weekly
2026-07-06
news.google.com 2026-07-06 Reuters
2026-06-16
chargedevs.com 2026-06-16 Charged EVs
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2026-06-15
www.electronicsforyou.biz 2026-06-15 Electronics For You BUSINESS
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2026-06-14
digitimes.com 2026-06-14
The global power semiconductor supply chain is undergoing another reshuffling, after Chinese chipmaker Nexperia triggered disruptions in 2025 and, more recently, China's Yangjie Technology was added to the European Union sanctions list.
2026-06-13
digitimes.com 2026-06-13
During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic re
2026-06-12
www.bisinfotech.com 2026-06-12 Bisinfotech
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2026-06-11
www.newelectronics.co.uk 2026-06-11 New Electronics
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2026-06-10
www.semiconductor-today.com 2026-06-10 Semiconductor Today
Nexperia expands 650V industrial-grade high-power GaN FET portfolio Discrete device designer and manufacturer Nexperia B.V. of Nijmegen, the Netherlands (which operates wafer fabs in Hamburg, Germany, and Hazel Grove Manchester, UK) has expanded its portfolio of 650V industrial-grade high-power gallium nitride (GaN) FETs for demanding power conversion applications. The portfolio includes devices
2026-06-10
www.electronicsweekly.com 2026-06-10 Electronics Weekly
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2026-06-10
www.newelectronics.co.uk 2026-06-10 New Electronics
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2026-06-09
www.electronicsmedia.info 2026-06-09 Electronics Media
Nexperia and Semikron Danfoss Explore Strategic Collaboration on SiC Power Modules for Automotive Applications By Electronics Media - June 9, 2026 Share on Facebook Tweet on Twitter tweet SiC Power Modules – Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive trac
2026-06-09
www.automotiveworld.com 2026-06-09 Automotive World
QDPAK's top-side thermal path allows the PCB and semiconductor domains to be managed separately, unlocking more power in less space June 9, 2026 Nexperia has launched 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging for electric vehicle (EV) and industrial power conversion, enabling up to 3 kW more output power than conventional D2PAK-7 devices at comparable thermal limits. The portfolio
2026-06-09
www.automotiveworld.com 2026-06-09 Automotive World
Combining SiC chip expertise with module packaging could unlock EV drivetrain gains neither company achieves independently June 9, 2026 Nexperia and Semikron Danfoss have signed a memorandum of understanding to explore a joint approach to silicon carbide (SiC)-based power modules for automotive traction inverter applications. The collaboration would combine Nexperia’s SiC semiconductor expertise
2026-06-08
digitimes.com 2026-06-08
Wingtech has launched a lawsuit in China against Nexperia's Dutch entities and related parties, intensifying a dispute that could affect semiconductor supply chains, corporate governance, and cross-border investment rules for customers and investors worldwide. The case adds another layer to a legal battle already spanning China and the Netherlands.
2026-05-27
news.google.com 2026-05-27 Business Wire
2026-05-26
digitimes.com 2026-05-26
Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages worth CNY8 billion (approx. US$1.2 billion). The case is the latest development of the legal troubles between the Chinese company and its subsidiary following the Dutch government's seizure of the company in late 2025
2026-04-09
eetimes.com 2026-04-09 Pat Brans
As the Nexperia episode sharpens Europe’s focus, experts say resilience will hinge on application relevance, supply chain depth, and smarter investment priorities.