Nexperia and Semikron Danfoss consider partnership on EV SiC power modules - New Electronics

The potential partnership between Nexperia and Semikron Danfoss in electric vehicle silicon carbide power modules reflects the semiconductor industry's response to the rapid growth of the EV market. T... Read original →

A potential Nexperia–Semikron Danfoss alliance in automotive SiC power modules would trigger a cascade across the power semiconductor stack: upstream substrate suppliers face intensified capacity pressure, while OEMs accelerate 800V platform adoption. EU’s Net-Zero Industry Act and U.S. IRA are raising localization barriers, compelling firms to share compliance costs and supply chain risks through partnerships. Infineon and STMicroelectronics will likely counter by fast-tracking their integrated SiC capacity and locking in automaker partnerships. Over the next 12–24 months, the industry will shift toward ‘module-defined chips’—system-level performance demands will dictate device architecture, making it untenable for standalone chip vendors to meet automakers’ combined requirements on reliability, thermal management, and cost. This move signals that competition has pivoted from components to ecosystems, marginalizing players without vertical integration.