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Semiconductors Tech China’s JCET to build new plant in Shanghai to expand advanced chip packaging US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development 2-MIN READ 0 Listen Make SCMP preferred on Google Xinmei Shen Published: 8:30am, 25 Jun 2026 Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics

Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.

Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market demand for power management components is steadily increasing, driving growth in lead frame shipments. Demand for microcontrollers (MCUs) used in PCs, networking equipment, industrial control systems, and electric vehicl