Semiconductor News & Analysis Feed
195 articles
2026-05-26
www.tweaktown.com
2026-05-26
TweakTown
AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging
The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache.
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Hassam Nasir
Tech Reporter
Published May 25, 2026 2:50 PM CDT
2 minutes & 30 seconds read time
TL;DR: AMD is preparing its Zen 7 "Grim
2026-05-26
www.benzinga.com
2026-05-26
Benzinga
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2026-05-26
www.taipeitimes.com
2026-05-26
Taipei Times
Huawei Technologies Co (華為) said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.
Right now there is about a five-year gap between what TSMC is capable of and what Huawei, together with its manufacturing partner Semicond
2026-05-25
www.tikr.com
2026-05-25
TIKR.com
Key Stats for Apple Stock
Price change for Apple stock: 1%
$AAPL Share Price as of May. 22: $309
52-Week High: $311
$AAPL Stock Price Target: $309
Now Live: Discover how much upside your favorite stocks could have using TIKR’s new Valuation Model (It’s free)>>>
What Happened?
Apple (AAPL) stock could be under pressure after Chinese tech giant Huawei announced a major semiconductor breakthrough
2026-05-25
www.nbcnews.com
2026-05-25
NBC News
ASIA
China’s Huawei touts chip design breakthrough in bid to defy U.S. sanctions
The tech giant said Monday that it had achieved a breakthrough that would allow it to make cutting-edge chips within five years.
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Huawei stand at the Shanghai New International Expo Centre, China, in 2025.Ying Tang / NurPhoto via Getty Images
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2026-05-25
tomshardware.com
2026-05-25
Etiido Uko
Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture
2026-05-25
www.tomshardware.com
2026-05-25
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law
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By Etiido Uko published 11 hours ago
Flagship Huawei Mate 90 series will be the first commercial processo
2026-05-25
www.ndtv.com
2026-05-25
NDTV
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2026-05-25
fortune.com
2026-05-25
Fortune
Huawei Technologies Co. said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co., potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.
Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semiconductor Manufactur
2026-05-25
ktar.com
2026-05-25
KTAR News 92.3 FM
ARIZONA EDUCATION NEWS
ASU teams up with TSMC Arizona for free semiconductor training program
May 25, 2026, 5:01 AM
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BY SHIRA TANZER
KTAR News 92.3 FM education solutions reporter
Arizona State University and TSMC Arizona are partnering to launch a semiconductor training program, guaranteeing graduates an interview with the chipmaking company upon completi
2026-05-25
ddnews.gov.in
2026-05-25
DD News
6 hours ago | Huawei
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Huawei Claims Breakthrough Chip Design Could Rival Global Leaders Amid US Sanctions
Chinese technology company Huawei has announced a new chip manufacturing approach that it says could help produce advanced semiconductors comparable to some of the world’s most cutting-edge processors, despite ongoing US restrictions on access to key manufacturing technologies.
The com
2026-05-25
ddindia.co.in
2026-05-25
DD India
Top Stories of the Day
May 25, 2026 3:24 PM IST
Huawei claims breakthrough chip design could rival global leaders amid US sanctions
Author: DD India
Chinese technology company Huawei has announced a new chip manufacturing approach that it says could help produce advanced semiconductors comparable to some of the world’s most cutting-edge processors, despite ongoing US restrictions on access to
2026-05-25
www.gurufocus.com
2026-05-25
GuruFocus
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2026-05-25
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2026-05-25
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2026-05-25 HKT 17:00
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Huawei Technologies has designed and mass-produced 381 chips over the past six years based on the Tau Sc
2026-05-25
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2026-05-25
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Huawei Technologies has designed and mass-produced 381 chips over the past six years based on the Tau Sc
2026-05-25
seekingalpha.com
2026-05-25
Seeking Alpha
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2026-05-25
www.asiaone.com
2026-05-25
AsiaOne
China's Huawei reveals chip design breakthrough amid US sanctions
SHANGHAI/BEIJING — Huawei Technologies said on Monday (May 25) it will make industry-leading semiconductors using a new technology in five years, underscoring Beijing's efforts to neutralise US sanctions that have made it hard for China to build cutting-edge chips.
Huawei, in a semiconductor symposium in Shanghai, said its high-en
2026-05-25
moderndiplomacy.eu
2026-05-25
Modern Diplomacy
WORLD NEWS
Huawei Unveils Major Chip Design Breakthrough as China Pushes Past US Sanctions
Chinese technology giant Huawei Technologies has announced a major semiconductor design breakthrough that could significantly reshape the global technology race and weaken the long term impact of U.S. sanctions on China’s chip industry.
SANA KHAN
MAY 25, 2026
Photo by Omid Armin on Unsplash
Chinese techno
2026-05-25
www.devdiscourse.com
2026-05-25
Devdiscourse
UPDATE 3-China's Huawei reveals chip design breakthrough amid US sanctions
While the global chip industry is increasingly investing in post-Moore's Law solutions, from advanced packaging to chiplets, the search has become especially urgent for China. U.S. export controls have restricted Chinese companies' access to the most advanced chipmaking tools, particularly the equipment needed to make chips
2026-05-25
www.marketbeat.com
2026-05-25
MarketBeat
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