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AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache. VIEW GALLERY - 3 Hassam Nasir Tech Reporter Published May 25, 2026 2:50 PM CDT 2 minutes & 30 seconds read time TL;DR: AMD is preparing its Zen 7 "Grim

Published: May 25, 2026 | Source: Taiwan Commercial Times | Author: Mark Campbell AMD Zen 7 Details Leak – “Grimlock” to use TSMC A14 node AMD has big plans for Zen 7 – More cores, more cache, and TSMC A14 silicon AMD is reportedly planning to use TSMC’s A14 lithography node for its Zen 7 “Grimlock” desktop CPUs. The Taiwan Commercial Times has reported that AMD is already preparing its supply c

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AMD's next-gen Zen 7 "Grimlock" CPUs are rumored to utilize TSMC's 1.4nm (A14) process tech & new packaging innovations. The Zen 6 architecture is yet to make a formal entry into mainstream server and consumer segments, and while mass production has already begun on TSMC's 2nm process tech, the company is now prepping its supply chain partners for the next-generation lineup. In a report by Taiwa