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2026-10-20
Vadzo Imaging Validates Bolt-544CRS 5MP Onsemi HyperLux LP AR0544 Color MIPI CSI-2 Camera on Rockchip RV1126 for Embedded Vision Applications - www.newswire.com
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news.google.com 2026-10-20
05441126544applicationsarboltcameracolor
2026-10-19
Samsung to use TSMC’s 3nm process for Nvidia’s next-generation HBM chips: Report - Firstpost
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2 sources 2026-10-19 digitimes.comnews.google.com
firstposthbmnvidiareportsamsungtsmc
2026-10-19
Apple Prepares To Debut 1.4nm A22 Pro Chips As TSMC Scales Up In 2028 - The Mac Observer
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news.google.com 2026-10-19
202822appleaschipsdebutinmac
2026-10-19
Terafab reportedly to receive first ASML EUV scanner in mid-2027 - Bits&Chips
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news.google.com 2026-10-19
2027asmlbitschipseuvterafab
2026-10-19
Chinese startup presents 15-watt EUV source prototype - Bits&Chips
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news.google.com 2026-10-19
15bitschinesechipseuv
2026-10-19
Semiconductor equipment demand rises as risks curb AI bubble
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digitimes.com 2026-10-19
aisemiconductor
2026-10-19
Memory squeeze leaves Brightek short on chips; Chinese automakers line up for Nantong plant
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digitimes.com 2026-10-19
brightekchinesememorynantong
2026-10-19
TSMC's only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D
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digitimes.com 2026-10-19
aiasiclandkoreansouthtaiwantsmcvca
2026-10-19
Shipments of high-end cloud AI accelerators, 2027
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digitimes.com 2026-10-19
2027aishipments
2026-10-19
SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
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digitimes.com 2026-10-19
hynixsk
2026-10-19
India roundup: Tata chip bets face execution test as India semiconductor ecosystem expands - digitimes
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news.google.com 2026-10-19
indiatata
2026-10-19
Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
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digitimes.com 2026-10-19
2027aibonderhanmitcwide
2026-10-19
Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
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digitimes.com 2026-10-19
exclusivewooptix
2026-10-19
IBM and Siemens collaborate to advance nanostack chip architecture
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digitimes.com 2026-10-19
ibmsiemens
2026-10-14
SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
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2 sources 2026-10-14 digitimes.comnews.google.com
aihbmhynixmicronsk