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209 articles
2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
www.digitimes.com
2026-05-29
digitimes
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house...
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2026-05-29
www.techedt.com
2026-05-29
Tech Edition
Huawei has unveiled a new chip design strategy to overcome US sanctions and improve processor performance.
Huawei has announced a new chip design strategy that it believes could help the company overcome the impact of long-running US sanctions and develop processors with performance levels comparable to future 1.4nm-class chips.
The Chinese technology company revealed the approach nearly six yea
2026-05-29
www.hpcwire.com
2026-05-29
HPCwire
www.hpcwire.com
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2026-05-28
tomshardware.com
2026-05-28
Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
www.phonearena.com
2026-05-28
PhoneArena
www.phonearena.com
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2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
www.hardwarezone.com.sg
2026-05-28
HardwareZone
MOBILE
Huawei announces new chip design strategy to bypass US sanctions
Huawei’s Tau Scaling Law focuses on reducing the time for signals and data to move through chips and computing systems.
By Shawn Tan - 28 May 2026
Huawei’s new chip design strategy allows the company to bypass US sanctions to build more advanced chips.
Six years after losing access to leading overseas chip manufacturers, H
2026-05-28
www.idnfinancials.com
2026-05-28
IDNFinancials.com
Huawei claims production of a new chip design to catch up with US tech
Lisa Monica, Dhika Priambodo
May 28, 2026 7:00 AM
WhatsApp Channel
Huawei claims progress in chip design to reduce reliance on US technology
SHANGHAI – Chinese technology giant Huawei said on Monday it had achieved a breakthrough that could allow the company to produce advanced chips within the next five years, in what has bee
2026-05-28
digitimes.com
2026-05-28
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
2026-05-28
digitimes.com
2026-05-28
Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip analysts, and research firms.
2026-05-28
digitimes.com
2026-05-28
As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission times across electronic systems.
2026-05-28
www.gsmarena.com
2026-05-28
GSMArena.com
Shortly after Huawei brought to light its new scaling law called Tao Scaling Law and its LogicFolding architecture, the company held a keynote at the Phoenix Bay Area Finance Forum and Financial Summit in Shenzhen, promising to bring a much more powerful, next-generation Kirin chipset that will power the upcoming Mate 90 lineup.
The chip in question is said to be the first mobile chip for the com
2026-05-27
news.google.com
2026-05-27
EDN - Voice of the Engineer
2026-05-27
wccftech.com
2026-05-27
Wccftech
After Huawei made a big announcement earlier this week about its Tau scaling technology, through which it aims to achieve a transistor density similar to the 14 Angstrom (14A) manufacturing process technologies from leading chip manufacturers such as TSMC and Intel, semiconductor analyst Dr. Ian Cutress believes that the announcement compares unrelated aspects of a chip's performance specification
2026-05-27
wccftech.com
2026-05-27
Wccftech
After Huawei made a big announcement earlier this week about its Tau scaling technology, through which it aims to achieve a transistor density similar to the 14 Angstrom (14A) manufacturing process technologies from leading chip manufacturers such as TSMC and Intel, semiconductor analyst Dr. Ian Cutress believes that the announcement compares unrelated aspects of a chip's performance specification
2026-05-27
www.huaweicentral.com
2026-05-27
Huawei Central
HUAWEI
Mate 90 series chip will be close to 3nm process tech: Huawei
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May 27, 2026
By
Emiko Matsui
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Huawei has made another statement regarding the Mate 90 series chip tech, which may draw level with the 3nm process technology. The company stated this at the 2026 Phoenix Bay Area Finance Forum and Financial S
2026-05-27
www.gizmochina.com
2026-05-27
Gizmochina
HuaweiNews
Huawei Mate 90 series officially confirmed to feature 3nm chip, could be called Kirin 9050 Pro
By Anvinraj Valiyathara -
May 27, 2026
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Huawei appears to be preparing a major leap in smartphone chip technology with the upcoming Huawei Mate 90 series. During a recent finance-focused 20th Shenzhen International Financial Expo