Mate 90 series chip will be close to 3nm process tech: Huawei - Huawei Central

At the 2026 Phoenix Bay Area Finance Forum held in Shenzhen, Huawei revealed that the chip technology powering its upcoming Mate 90 series is approaching 3nm process capabilities. CTO Zheng Jun of Hua... Read original →

Huawei’s near-3nm chip for the Mate 90 series isn’t just a process node leap—it’s a paradigm shift driven by the 'Tao Scaling Law' and LogicFolding, delivering a 53.5% transistor density gain. This forces rapid evolution across EDA, advanced packaging, and domestic EUV alternatives, accelerating investments by SMIC and SMEE in multi-patterning and High-NA EUV paths. Despite avoiding TSMC (Taiwan, China) fabs, U.S. BIS could still invoke the Foreign Direct Product Rule to restrict equipment and IP, compelling Huawei to rebuild a de-Americanized supply chain at 15–20% higher R&D cost. NVIDIA’s AI dominance in China is now under direct threat; its likely countermove involves partial CUDA ecosystem openness to retain developer loyalty. If Huawei achieves stable volume production and expands into automotive and server markets within 18 months, global logic chip leadership will tilt decisively eastward.