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WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to NT$1.073 billion (US$33.9 million) in May 2026, the company's second-highest monthly total on record. For global readers tracking the semiconductor supply chain, the results signal how AI infrastructure demand is resha
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Korea’s Leading Telco to Add NVIDIA-Powered AI Cloud Capacity Built on NVIDIA DSX AI Factory Architecture to Accelerate AI Startups, Robotics and Industrial Physical AI
SEOUL, South Korea, June 8, 2026 — NVIDIA and SK Telecom have announced that SK Telecom plans to build a gigawatt-scale AI Cloud in Korea using the NVIDIA DSX platform, with the first AI factory coming online in 2027.
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2026-06-09
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2026-06-09
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Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs
Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs
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CDNS
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2026-06-09
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2026-06-09
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Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
Business Wire
Mon 8 June 2026 at 1:15 pm GMT-7 2 min read
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Expanded cooperation spans DTCO, IP readiness and design enablement to advance next-generation c
2026-06-09
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2026-06-09
lincolnjournal.com
Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
42 mins ago
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2026-06-09
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2026-06-09
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Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
2 hrs ago
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Cadence (Nasdaq: CDNS) today announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies
2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
www.hpcwire.com
2026-06-09
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2026-06-05
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2026-06-05
Semiconductor Engineering
2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-02
www.electronicsforyou.biz
2026-06-02
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2026-06-02
www.hpcwire.com
2026-06-02
HPCwire
TAIPEI, Taiwan, June 1, 2026 — NVIDIA today announced that TSMC is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing.
As chips move to more advanced nodes, bringing them from design to high-volume production has become one of the world’s most complex computing challenges. Computational lithography, transistor simulation, process control and wafer inspecti
2026-06-02
www.hpcwire.com
2026-06-02
HPCwire
Level-5 ChipStack AI Super Agent framework and NVIDIA OpenShell runtime advance secure, agentic AI across semiconductor development
SAN JOSE, Calif., June 1, 2026 — At Computex 2026, Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA)
2026-05-30
www.hpcwire.com
2026-05-30
HPCwire
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2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.