Semiconductor News & Analysis Feed
3326 articles
2026-06-12
www.digitimes.com
2026-06-12
digitimes
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness...
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2026-06-12
www.reuters.com
2026-06-12
Reuters
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2026-06-12
www.businesstimes.com.sg
2026-06-12
The Business Times
Singapore announces new road map to improve standards and conformance capabilities, partnerships
Five memorandums of understanding between EnterpriseSG and its international and regional partners are formalised
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Elysia Tan
Published Fri, Jun 12, 2026 · 10:30 AM
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DPM Gan says the new road map aims to “build and deepen trust, so that assu
2026-06-12
pandaily.com
2026-06-12
Pandaily
categories.technology
China Delivers 5 Million GaN RF Chips for 6G Networks in Breakthrough Commercial Deployment
Published:
June 12, 2026
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China Delivers 5 Million GaN RF Chips for 6G Networks in Breakthrough Commercial Deployment China has delivered five million gallium nitride (GaN) radio freque...
China Delivers 5
2026-06-12
digitimes.com
2026-06-12
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.
2026-06-12
www.bloomberg.com
2026-06-12
Bloomberg.com
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2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
Broadcom has acknowledged it will not win all of Google's TPU orders, highlighting how tensor processing units have become a competitive arena for multiple chipmakers. For global readers, the shift signals a broader race for cloud AI supply, capacity, and influence, as more firms vie for a share of high-value custom chip demand.
2026-06-12
digitimes.com
2026-06-12
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used by chips. After the post-pandemic inventory correction, industry players say power semiconductors have shifted "from a supporting role to the lead" under the new AI high-voltage direct current (HVDC) power architecture.
2026-06-12
digitimes.com
2026-06-12
China's two leading memory chipmakers, CXMT and YMTC, are moving closer to the capital market, putting the country's memory industry back under the semiconductor spotlight.
2026-06-12
digitimes.com
2026-06-12
Taiwanese power management IC supplier Global Mixed-mode Technology (GMT) will follow peers in seeking price increases from customers as tight chip supply continues to reshape capacity allocation across the industry.
2026-06-12
digitimes.com
2026-06-12
India's official think tank NITI Aayog has outlined a 2035 roadmap for India to become a more central part of the global semiconductor industry, warning that continued reliance on imports leaves the country exposed to cost, supply, and security risks.
2026-06-12
digitimes.com
2026-06-12
Silicon Labs is deepening its presence in India through expanded research operations and a greater commercial focus on smart infrastructure applications, even as the US-based wireless chipmaker prepares for an acquisition by Texas Instruments.
2026-06-12
digitimes.com
2026-06-12
As CXMT and YMTC move toward initial public offerings, other players across China's memory supply chain are also advancing expansion, fundraising, and listing plans. The activity spans memory modules, controller chips, and niche DRAM, underscoring how China's memory industry is evolving from upstream chipmakers into a broader supply chain ecosystem.
2026-06-12
digitimes.com
2026-06-12
Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway from a recent panel discussion at SuperAI Singapore, which brought chip makers and an AI model accelerator together to address how to overcome inference bottlenecks at a time when compute workloads are hitting up against physical limits.
2026-06-12
digitimes.com
2026-06-12
TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed that the US government could block imports to the US of chips made by TSMC as a result of the case, and have enlisted several members of Congress to support their position, drawing market attention.
2026-06-12
digitimes.com
2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com
2026-06-12
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every layer of the infrastructure stack, from power generation to chip manufacturing to data center construction. That was the assessment of Sachin Hindupur, global strategy and operations leader at AMD, in a presentation
2026-06-12
digitimes.com
2026-06-12
SK Hynix's latest fire at its Cheongju, South Korea, campus has again disrupted operations at a key memory-chip site and prompted evacuations of thousands of workers. The incident adds to a series of recent accidents, raising fresh safety concerns for semiconductor plants worldwide that depend on hazardous gases and chemicals.
2026-06-12
digitimes.com
2026-06-12
Elon Musk's planned Terafab chipmaking project has taken an early equipment-sourcing step, with South Korean equipment maker HPSP reportedly receiving a purchase order for high-pressure hydrogen annealing equipment.