Semiconductor News & Analysis Feed
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2026-08-18
biz.chosun.com
2026-08-18
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finance.biggo.com
2026-08-18
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finance.biggo.com
2026-08-11
2026-08-05
www.tradingkey.com
2026-08-05
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2026-07-20
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www.digitimes.com
2026-07-20
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pulse.mk.co.kr
2026-07-15
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finance.biggo.com
2026-07-15
2026-07-14
news.google.com
2026-07-14
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2026-06-30
biz.chosun.com
2026-06-30
Hanmi Semiconductor announced the launch of its new 2.5D TC Bonder 40 equipment on June 30, 2026, aimed at supporting advanced packaging processes for AI system semiconductors. Designed specifically for the CoWoS (Chip on Wafer on Substrate) process, the device can handle dies ranging from 3x3 mm to
2026-06-26
en.sedaily.com
2026-06-26
Hanmi Semiconductor is targeting the AI packaging market following its dominance in HBM technology. As AI computing demands surge, the semiconductor industry is experiencing increased demand for high-performance memory and advanced packaging solutions. HBM technology, currently a core component in d
2026-06-26
en.sedaily.com
2026-06-26
Hanmi Semiconductor is aggressively targeting the AI packaging market following its dominance in HBM (High Bandwidth Memory). This strategic move reflects the semiconductor industry's shift from traditional chip manufacturing to high-value packaging technologies, driven by surging AI computing deman
2026-06-26
biz.chosun.com
2026-06-26
HANMI Semiconductor unveiled its new equipment, the FC Bonder 3.5, designed for artificial intelligence (AI) system semiconductors on June 26, 2026. This device supports 2.5D packaging, enabling the integration of multiple chips such as GPUs, CPUs, and high bandwidth memory (HBM) onto a single subst
2026-06-13
news.google.com
2026-06-13
2026-06-12
news.google.com
2026-06-12
2026-06-12
news.google.com
2026-06-12
2026-06-12
2026-06-04
biz.chosun.com
2026-06-04
Hanmi Semiconductor made its debut at the 2026 Computex exhibition in Taiwan, showcasing its latest advancements in high-bandwidth memory (HBM) and next-generation 2.5D packaging technologies. The company unveiled the TC Bonder 4 for HBM4 mass production and the Wide TC Bonder, designed to support l