Semiconductor News & Analysis Feed
20 articles
2026-10-20
2026-10-19
www.businesskorea.co.kr
2026-10-19
2026-09-22
www.chosun.com
2026-09-22
2026-09-22
finance.biggo.com
2026-09-22
Hanmi Semiconductor's delivery of its first FC Bonder 75 to a global customer marks a pivotal strategic inflection point for the South Korean equipment maker. Historically anchored in the HBM TC bonder niche, Hanmi has now crossed into the broader AI back-end packaging equipment space, signaling a d
2026-09-16
www.digitimes.com
2026-09-16
2026-09-16
2026-09-15
www.kedglobal.com
2026-09-15
2026-08-18
biz.chosun.com
2026-08-18
2026-08-18
finance.biggo.com
2026-08-18
2026-08-11
finance.biggo.com
2026-08-11
2026-08-05
www.tradingkey.com
2026-08-05
2026-07-20
www.tradingview.com
2026-07-20
2026-07-20
www.digitimes.com
2026-07-20
2026-07-15
2026-07-15
pulse.mk.co.kr
2026-07-15
2026-07-15
finance.biggo.com
2026-07-15
2026-07-14
news.google.com
2026-07-14
2026-07-08
2026-06-30
biz.chosun.com
2026-06-30
Hanmi Semiconductor announced the launch of its new 2.5D TC Bonder 40 equipment on June 30, 2026, aimed at supporting advanced packaging processes for AI system semiconductors. Designed specifically for the CoWoS (Chip on Wafer on Substrate) process, the device can handle dies ranging from 3x3 mm to
2026-06-26
en.sedaily.com
2026-06-26
Hanmi Semiconductor is targeting the AI packaging market following its dominance in HBM technology. As AI computing demands surge, the semiconductor industry is experiencing increased demand for high-performance memory and advanced packaging solutions. HBM technology, currently a core component in d