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2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
semiengineering.com
2026-06-15
Semiconductor Engineering
Researchers from Politecnico di Torino and CEA-List published a technical paper titled “InjectV: Modeling Fault Injection Attacks in RISC-V Simulation Environment.”
“Fault Injection Attacks (FIAs) are a significant threat to hardware security, capable of compromising systems by inducing malicious faults in computation or storage. Evaluating resilience against such attacks is challenging due to th
2026-06-13
phys.org
2026-06-13
Phys.org
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2026-06-13
interestingengineering.com
2026-06-13
Interesting Engineering
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2026-06-12
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2026-06-12
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2026-06-12
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2026-06-12
Semiconductor Engineering
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2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
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CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering
PR Newswire
Thu, June 11, 2026 at 9:00 PM PDT 3 min read
HYDERABAD, India and SEBERANG PERAI, Malaysia, June 12, 2026 /PRNewswire/ -- The semiconductor industry is under growing pressure
2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
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CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering
PR Newswire
Thu, June 11, 2026 at 6:30 PM PDT 2 min read
SEBERANG PERAI, Malaysia, June 12, 2026 /PRNewswire/ -- The semiconductor industry is under growing pressure to deliver more capa
2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
news.google.com
2026-06-12
Semiconductor Engineering
2026-06-11
www.enr.com
2026-06-11
Engineering News-Record (ENR)
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2026-06-11
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2026-06-11
The Futurum Group
2026-06-11
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2026-06-11
Engineering.com
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2026-06-11
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2026-06-11
Semiconductor Engineering
Energy-efficient SoC design, optimizing PPA, deep low-voltage operation, and advanced power management techniques.
Access “Foundation IP: Pushing the Boundaries of Energy-Efficient Chip Design” to explore six articles that explain how to address SoC design challenges using advanced Foundation IP solutions. Learn how these approaches enable energy efficiency, high performance, and reliability acro
2026-06-11
digitimes.com
2026-06-11
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials engineering. The shift matters far beyond one company, because AI demand is increasing worldwide and is expected to influence data centers, device costs, energy use, and the pace of technology development.
2026-06-11
digitimes.com
2026-06-11
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of "software-hardware integration."
2026-06-10
www.engineering.com
2026-06-10
Engineering.com
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2026-06-10
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2026-06-10
Engineering.com
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2026-06-09
www.engineering.com
2026-06-09
Engineering.com
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