Semiconductor News & Analysis Feed
168 articles
2026-07-23
eetimes.com
2026-07-23
Altera has taped out six chips in nine months, three ahead of schedule, as new CEO focuses on execution.
2026-07-22
digitimes.com
2026-07-22
Nvidia has outlined the design of its Vera CPU, positioning the chip for agentic AI systems that rely heavily on the processor for code execution, tool calls, retrieval, and data handling. The company said the architecture is intended to improve responsiveness, throughput, and latency consistency for developers and operators worldwide as AI infrastructure becomes more CPU-dependent.
2026-07-22
www.inc.com
2026-07-22
inc.com
2026-07-21
eetimes.com
2026-07-21
Canatu stacks its C-suite to push CNTs into chips, cars, and diagnostics—watch how its new CEO plans to turn nanotube hype into yield.
2026-07-21
news.google.com
2026-07-21
Freedom For All Americans
2026-07-20
www.pharmexec.com
2026-07-20
Pharmaceutical Executive
2026-07-20
digitimes.com
2026-07-20
Nvidia founder and CEO Jensen Huang spent last week in Tokyo meeting government officials, robotics makers and dozens of supply chain executives, as the company deepens its push into Japan's manufacturing and AI ecosystem, according to a blog post published on Nvidia's website and its official newsroom release.
2026-07-18
www.executivegov.com
2026-07-18
ExecutiveGov
2026-07-18
www.executivegov.com
2026-07-18
ExecutiveGov
2026-07-18
www.indexbox.io
2026-07-18
IndexBox
2026-07-17
digitimes.com
2026-07-17
TSMC said on July 16 that it will add US$100 billion to its US investment, bringing the total to US$265 billion. Taiwan's Executive Yuan said it respects companies expanding in the US to meet global market demand, while also backing the chipmaker's continued fab expansion in Taiwan.
2026-07-16
www.nscale.com
2026-07-16
Nscale
2026-07-16
digitimes.com
2026-07-16
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced packaging materials are poised to outgrow front-end process materials and the broader mate
2026-07-16
digitimes.com
2026-07-16
CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker is using the capital market to connect semiconductor suppliers, AI cloud providers, device brands, automakers, and state-backed investors, reinforcing a domestic memory ecosystem.
2026-07-16
digitimes.com
2026-07-16
Nvidia co-founder and chief executive Jensen Huang used a developer event in Tokyo on July 15 to reject reports that manufacturing problems could delay its next-generation AI accelerator systems, telling reporters the claims were "not true" and that "Vera Rubin is already in production. Giant amounts of production incoming."
2026-07-16
digitimes.com
2026-07-16
During the question-and-answer session of ASML's second-quarter 2026 earnings call on July 15, executives at the world's only maker of extreme ultraviolet (EUV) lithography systems signaled that they now have room to raise prices and are preparing to expand output of their most important machines by roughly 30% in each of the next two years — all without building new cleanrooms. The tone confirmed
2026-07-16
news.google.com
2026-07-16
Stock Titan
2026-07-16
www.investors.com
2026-07-16
Investor's Business Daily
2026-07-16
tomshardware.com
2026-07-16
Anton Shilov
Chief executive of Nvidia says the company is on track to produce 'giant amounts' of Vera Rubin-based machines, but fails to address rumored delays of Kyber NVL144 racks from 2027 to 2028.
2026-07-15
www.businessinsider.com
2026-07-15
Business Insider