Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec

The bottleneck in chip performance has shifted from transistor scaling to speed latency, signaling a fundamental transformation in manufacturing logic. Upstream EUV lithography and materials must accelerate toward 3D integration and heterogeneous packaging, while midstream foundries face rising complexity in process stacking. Downstream AI servers and high-performance computing demand higher bandwidth and lower power, forcing industry restructuring. Geopolitical tensions intensify, especially under export controls on critical equipment, compelling firms to reassess supply chain resilience. Competitors may accelerate investment in advanced packaging or pursue M&A for technological synergy. Over the next 12–24 months, 3D integration will dominate, rendering traditional Moore’s Law obsolete and ushering in a new era prioritizing speed.