Semiconductor News & Analysis Feed
8448 articles
2026-05-27
digitimes.com
2026-05-27
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption.
2026-05-27
digitimes.com
2026-05-27
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.
2026-05-27
digitimes.com
2026-05-27
Computex 2026 is set to officially open in Taipei, and Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang has stated that the combined market capitalization of foreign companies participating in forums and keynote sessions at this year's event exceeds US$10 trillion. He also said that TAITRA has allocated the entire Taipei International Convention Center (TICC) exclusivel
2026-05-27
semiengineering.com
2026-05-27
Gregory Haley
As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvil...
2026-05-27
digitimes.com
2026-05-27
First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation story: it crystallizes a structural debate about whether AI has permanently transformed memory's earnings profile, a bubble concern as Chinese rivals ramp capacity, and a sharpening geopolitical contest over who con
2026-05-27
eetimes.com
2026-05-27
Gary Hilson
University of Saskatchewan will leverage quantum computing for health, defense, energy, and agriculture research.
2026-05-27
insurancenewsnet.com
2026-05-27
InsuranceNewsNet
insurancenewsnet.com
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-27
www.donga.com
2026-05-27
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2026-05-27
www.gurufocus.com
2026-05-27
GuruFocus
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2026-05-27
www.idahopress.com
2026-05-27
Idaho Press
BOISE — Welcome to the trillion dollar club, Micron.
Boise-headquartered Micron Technology’s stock price closed the trading day Tuesday up 19.29% to $895.88 per share, giving the semiconductor company a $1 trillion market cap.
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2026-05-27
www.techspot.com
2026-05-27
TechSpot
www.techspot.com
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2026-05-27
www.thelec.net
2026-05-27
thelec.net
SK hynix unveils its iHBM technology with enhanced thermal dissipation performance on May 26. (Source: SK hynix)
SK hynix on May 26 unveiled a new thermal management technology called "iHBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, emb
2026-05-27
www.fool.com
2026-05-27
The Motley Fool
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2026-05-27
eetimes.com
2026-05-27
The most important takeaway everyone missed at the 2026 Google I/O Conference.
2026-05-27
www.ibtimes.com
2026-05-27
International Business Times
By
Merin Rebecca Thomas
Published 05/26/26 AT 5:55 PM EDT
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ByteDance plans to purchase millions of Qualcomm application-specific integrated circuits, or ASICs, to support its AI agent software and broader artificial intelligence operations. AFP
Qualcomm has secured a deal to supply artificial intelligence ch
2026-05-27
www.cnbc.com
2026-05-27
CNBC
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2026-05-27
www.mk.co.kr
2026-05-27
매일경제
사진 확대
[Photo courtesy of Yonhap News]
SK hynix has unveiled a new iHBM technology that dramatically reduces heat by embedding Integrated Cooling Elements (ICE) in High Bandwidth Memory (HBM) packages.
HBM is a core component of AI semiconductors, but as each new generation stacks more layers and demands for speed continue to rise, heat generation has emerged as the biggest challenge. ICE is a co
2026-05-27
www.investors.com
2026-05-27
Investor's Business Daily
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