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Allegro DVT plays a pivotal role in the European CHASSIS program, contributing to the development of the Automotive Base Die chiplet, a 5nm technology that is set to revolutionize the automotive semiconductor landscape. This foundational chiplet, designed to enable seamless integration of third-part

This article presents a comprehensive evaluation of the SpacemiT K3 Pico-ITX development board running under the Bianbu OS 4.0 environment. Based on SpacemiT's self-developed 16-core RISC-V K3 SoC, the board features a Pico-ITX form factor with robust computing capabilities and diverse interface sup

Stellantis and Qualcomm have expanded their multi-year collaboration to power next-generation vehicles with Qualcomm’s Snapdragon® Digital Chassis™ system-on-chips (SoCs). The integration with Stellantis’ STLA Brain platform enhances cockpit, connectivity, and ADAS capabilities, aiming to accelerate