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2026-05-27
PR Newswire
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
NEWS PROVIDED BY
LG Innotek
May 27, 2026, 08:00 ET
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LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies
To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding
2026-05-27
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2026-05-27
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LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
Provided by PR Newswire May 27, 2026, 8:00:00 PM
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at
2026-05-27
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2026-05-27
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Forbes Daily: Micron Technology Is The Latest $1 Trillion Chipmaker
Today’s Forbes Daily newsletter covers the startup building AI for construction, BP removes board chair, Paxton wins Texas runoff, Iran threatens retaliation and more.
ByDanielle Chemtob,
Forbes Staff
andForbes Daily,
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May 27, 2026, 07:53am EDT
Eric Wu cofounded Opend
2026-05-27
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2026-05-27
MarketBeat
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2026-05-27
Luke James
The agreement allocates 10.5% of Samsung's semiconductor division operating profit as stock-based bonuses.
2026-05-27
www.huaweicentral.com
2026-05-27
Huawei Central
HUAWEI
Mate 90 series chip will be close to 3nm process tech: Huawei
Published
16 minutes ago
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May 27, 2026
By
Emiko Matsui
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Huawei has made another statement regarding the Mate 90 series chip tech, which may draw level with the 3nm process technology. The company stated this at the 2026 Phoenix Bay Area Finance Forum and Financial S
2026-05-27
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2026-05-27
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MaxLinear and GCT Semiconductor Partner to Develop Next-Generation 5G FWA and Converged Gateways
MaxLinear and GCT Semiconductor Partner to Develop Next-Generation 5G FWA and Converged Gateways
Provided by Business Wire May 27, 2026, 6:50:00 PM
MaxLinear and GCT Semiconductor Partner to Develop Next-Generation 5G FWA and Converged Gateways
The companies will showcase int
2026-05-27
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2026-05-27
Alternatives Watch
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2026-05-27
www.gizmochina.com
2026-05-27
Gizmochina
HuaweiNews
Huawei Mate 90 series officially confirmed to feature 3nm chip, could be called Kirin 9050 Pro
By Anvinraj Valiyathara -
May 27, 2026
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Huawei appears to be preparing a major leap in smartphone chip technology with the upcoming Huawei Mate 90 series. During a recent finance-focused 20th Shenzhen International Financial Expo
2026-05-27
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2026-05-27
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2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-27
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2026-05-27
MarketBeat
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