LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC - Morningstar

LG Innotek announced its participation in the 2026 Electronic Components and Technology Conference (ECTC) in Orlando, Florida, where it showcased next-generation semiconductor package substrate techno... Read original →

LG Innotek’s ECTC showcase of FC-BGA and chip-embedding tech triggers a 'signal-path revolution' in packaging—cutting power loss by 25% via shortened interconnects, directly alleviating AI chips’ thermal bottlenecks. This pressures ABF substrate suppliers to accelerate high-CTE material development while squeezing OSAT margins in advanced packaging. Geopolitically, bypassing Taiwan, China’s CoWoS-dominated ecosystem with Cu-Post and RF-SiP offers partial export-control insulation but incurs longer equipment qualification cycles and yield costs. Against Amkor and ASE’s capacity expansions, LG’s high-integration SiP bet targets Apple and Intel’s next-gen edge-AI devices. Within 18 months, if its 20% thinner RF-SiP proves viable in mmWave 5G modules, it could redefine RF front-end packaging standards and force Japanese substrate makers into urgent tech upgrades.