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2026-05-23
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2026-05-23
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2026-05-23
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2026-05-23
Panjit International Inc. is accelerating its expansion into AI and automotive electronics as the Taiwanese power semiconductor maker positions itself for a new growth cycle after four decades in the discrete device market.
2026-05-23
digitimes.com
2026-05-23
CXMT's planned Shanghai listing is becoming more than a test of investor appetite for China's top DRAM maker. It is also putting a spotlight on whether the company's next phase of expansion can accelerate China's push to localize semiconductor equipment and materials.
2026-05-23
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2026-05-23
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Asahi Kasei Launches Photosensitive Film for Advanced Packaging
The company combines photosensitive polyimide and dry film photoresist technologies to create innovative film for panel-level semiconductor packaging applications.
David Hutton
May 22, 2026
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2026-05-23
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2026-05-23
Advisor Perspectives
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2026-05-23
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2026-05-23
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2026-05-23
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2026-05-22
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2026-05-22
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Vadzo Imaging Introduces Innova-234CGS Color Camera: 2MP Global Shutter Gigabit Ethernet Camera Based on Onsemi AR0234 Sensor
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ACCESS Newswire
May 22, 2026 at 10:00 AM EDT
ⓘ This article is third-party content and does not represent the views of this site. We make no guaran
2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
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United Microelectronics (UMC) Announces Release of 14nm Embedded High-voltage (eHV) FinFET Technology Platform
Published on May 22, 2026 at 8:22 am by BOB KARR in News
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2026-05-22
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2026-05-22
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2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.
2026-05-22
digitimes.com
2026-05-22
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market
2026-05-22
digitimes.com
2026-05-22
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome