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2026-06-18
news.az
2026-06-18
Latest news from Azerbaijan
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2026-06-18
timestech.in
2026-06-18
TimesTech
BuzzProducts NewsT&M
Infineon CIPOS Prime 1200V CoolSiC Power Modules, Now at Mouser
By TimesTech -
June 18, 2026
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Mouser Electronics, the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the CIPOS Prime automotive CoolSiC power modules from Infineon Technologies.
The CIPOS Prime automotive C
2026-06-18
evertiq.com
2026-06-18
Evertiq
© Imec
General | June 18, 2026
Imec unlocks system-level III-V chiplet integration on Si-CMOS
Evertiq
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.
Imec, a Belgium-based research and innovation cen
2026-06-18
www.chosun.com
2026-06-18
조선일보
By Park Ji-min
Published 2026.06.18. 15:28
Updated 2026.06.18. 16:49
SK Hynix's 7th generation high-bandwidth memory (HBM4E) product. /SK Hynix
SK Hynix has begun supplying samples of its 7th-generation high-bandwidth memory (HBM4E) to major clients. Following Samsung Electronics’ announcement last month of becoming the first in the world to supply 12-layer HBM4E samples, SK Hynix’s entry into t
2026-06-18
www.tweaktown.com
2026-06-18
TweakTown
NVIDIA launches ACE Game Agent SDK Beta for in-game AI companions that run on RTX GPUs
NVIDIA unveils the ACE Game Agent SDK Beta At Unreal Fest 2026, enabling developers to add AI companions to games running on GeForce RTX GPUs.
VIEW GALLERY - 3
Kosta Andreadis
Senior Editor
Published Jun 18, 2026 1:29 AM CDT
1 minute & 30 seconds read time
TL;DR: NVIDIA has released the Beta of its ACE Game Ag
2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
QUALCOMM (QCOM) Is Up 11.4% After Launching Custom AI Data Center Silicon With a Hyperscaler
Sasha Jovanovic
Wed, June 17, 2026 at 11:09 PM PDT 3 min read
QCOM
+6.17%
Trade QCOM on Coinbase
Trading disclosure
In recent weeks, Qualcomm has moved beyond its smartphone roots by launching a custom AI data center silicon program with a leading hyperscaler, expanding collaborations in XR, edge AI, and
2026-06-18
www.somo.nl
2026-06-18
SOMO - The Centre for Research on Multinational Corporations
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Nvidia has become one of the biggest winners of the AI boom. Yet its influence extends far beyond the chips that power ChatGPT and other AI systems. Through a growing network of investments and partnerships, the company is shaping the future of the AI industry while increasi
2026-06-18
kfgo.com
2026-06-18
The Mighty 790 KFGO
SEOUL, June 18 (Reuters) – SK Hynix said on Thursday it has shipped samples of its latest high-bandwidth memory (HBM) chips to major customers, as the South Korean chipmaker seeks to strengthen its position in the fast-growing AI semiconductor market.
The next-generation 12-layer HBM4E chip reaches speeds of up to 16 gigabits per second per pin and offers over 20% better power efficien
2026-06-18
seekingalpha.com
2026-06-18
Seeking Alpha
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2026-06-18
seekingalpha.com
2026-06-18
Seeking Alpha
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2026-06-18
www.moomoo.com
2026-06-18
Moomoo
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2026-06-18
www.benzinga.com
2026-06-18
Benzinga
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2026-06-18
www.thelec.net
2026-06-18
thelec.net
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2026-06-18
smallcaps.com.au
2026-06-18
smallcaps.com.au
dorsaVi (ASX: DVL) has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip.
The company has developed the chip with NTU Singapore and ITRI Taiwan, and is now ready to move into tape-out and staged silicon implementation.
The design incorporates self-checking write-and-verify circuitry, compute-in
2026-06-18
www.tradingview.com
2026-06-18
TradingView
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dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI
dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI
2 min read
DVL
0
dorsaVi
DVL
has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip.
The company has developed the chip with NTU Singapo
2026-06-18
themachinemaker.com
2026-06-18
Machine Maker
themachinemaker.com
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2026-06-18
www.digitimes.com
2026-06-18
digitimes
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."...
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2026-06-18
www.thefastmode.com
2026-06-18
The Fast Mode
HPE announced new innovations to help customers transform into agentic enterprises and move AI into production with greater security, governance, and control. These new offerings transform the HPE AI Factory with NVIDIA for the next era of AI where intelligence adapts, evolves, collaborates, and governs.
Secure and governed agentic AI gives enterprises the controls needed to move agents from deve
2026-06-18
news.google.com
2026-06-18
EE Times Asia
2026-06-18
www.indexbox.io
2026-06-18
IndexBox
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