SK Hynix Supplies HBM4E Samples, Escalating AI Memory War - 조선일보

SK Hynix has begun supplying samples of its 7th-generation high-bandwidth memory (HBM4E) to key clients, intensifying competition with Samsung Electronics in the AI semiconductor memory market. Follow... Read original →

SK Hynix’s early HBM4E sampling isn’t just a tech race—it’s forcing a cascade redesign across the AI hardware stack. NVIDIA’s next-gen accelerators demand higher bandwidth and power efficiency, redirecting TSMC’s CoWoS packaging capacity toward HBM4E and away from GDDR6. Geopolitically, tighter U.S.-EU export controls on advanced memory benefit SK Hynix through its entrenched NVIDIA partnership, granting de facto regulatory leeway over Samsung despite comparable 1c-node DRAM tech. Samsung will likely counter with aggressive pricing and co-engineering deals targeting AMD and Google. Within 12–24 months, the HBM market will solidify into a duopoly—but the real bottleneck looms: if CoWoS capacity fails to scale with HBM4E volume, AI chip delivery timelines will slip system-wide, triggering cloud capex reassessments.