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Taiwan's semiconductor testing and probe card supply chain maintained solid momentum entering 2026, driven by continued AI accelerator, high-performance computing (HPC), and advanced packaging demand.

Multi-die assemblies greatly increase the number of things that can go wrong, and the d...

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators.

Copy linkFacebookXWhatsappRedditPinterestFlipboardThreadsEmailShare this article0Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterSkymizer claims giant AI models no longer need hyperscale GPU infrastructureOld 28nm chips suddenly power massive language models at surprisingly low wattageThe HTX301 squeezes 384 GB of memory into a single PCIe a

AMD now has the fastest AI accelerator card on the market that fits in a traditional PCIe slot.

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Nvidia's Jensen Huang reiterates that American companies should be able to ship their products globally, but maintains that the latest AI accelerators should remain in America.

It makes sense that the standard governing AI accelerators should release an update less than a year after its first iteration.Ultra Accelerator Link (UALink) 1.0 was released in April 2025, and the UALink consortium just released a major update to the specification that addresses in-network compute, chiplet definition, and manageability. These additions will support the deployment of UALink solut

The number and variety of test interfaces, coupled with increased packaging complexity,...