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Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer - Tom's Hardware

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www.tomshardware.com 2026-06-19

imec, ASML, and TSMC have achieved a significant breakthrough in 2D transistor technology, demonstrating complementary n- and p-type transistors with atomically thin channels on a 300mm wafer at a 50nm contacted poly pitch. Presented at the IEEE/JSAP Symposium on VLSI Technology and Circuits, the wo

2D materials transistor technology EUV lithography post-silicon era semiconductor manufacturing TSMC imec ASML

ASML, TSMC and Imec scale 2D transistors to 50nm pitch on 300mm wafers - Bits&Chips

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bits-chips.com 2026-06-15

ASML, TSMC, and imec have achieved scalable 2D transistor manufacturing on 300mm wafers with a 50nm pitch, marking a significant step toward industrial adoption of post-silicon logic devices. Presented at the 2026 IEEE/JSAP VLSI Symposium, the demonstration features both nFETs and pFETs using a CMOS

2D materials transistor manufacturing EUV lithography CMOS technology semiconductor fabrication wafer manufacturing transition metal dichalcogenides IC design

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