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High-bandwidth memory (HBM) is emerging as a critical testbed for 3D assembly testing and yield optimization. As data centers increasingly rely on high-performance computing for AI and graphics workloads, HBM's vertical stacking architecture delivers unmatched bandwidth through tightly coupled DRAMs

As AI and high-performance computing continue to drive demand, High Bandwidth Memory (HBM) has become a critical storage technology facing unprecedented testing challenges. HBM's vertical stacking of DRAM chips delivers ultra-high data bandwidth, but its complex structure introduces significant test