semiengineering.com
2026-09-24
The 3D-IC and chiplet revolution is fundamentally reshaping what EDA tools must deliver, exposing a structural mismatch between legacy design methodologies and the physics of modern AI/HPC systems. The central insight from this industry discussion is that the hardest problems in AI silicon have migr
pulse2.com
2026-08-27
Qnity Electronics has launched an integrated materials platform for advanced semiconductor packaging, combining metallization, bumping, dielectric, and fine-line patterning technologies to support increasingly complex AI and high-performance computing architectures. The platform targets next-generat