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By  Jeong Du-yong Published 2026.06.29. 10:01 The lineup of 3D chip manufacturing equipment for AI semiconductors unveiled by Applied Materials./Courtesy of Applied Materials Semiconductor equipment corporations Applied Materials unveiled a lineup of 3D chip manufacturing tools for artificial intelligence (AI) semiconductors. The focus is on expanding planarization, deposition and metrology tools

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.

This is a paid press release. Contact the press release distributor directly with any inquiries. Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling Applied Materials, Inc. Mon, June 15, 2026 at 1:05 PM PDT 5 min read AMAT -3.00% Trade AMAT on Coinbase Trading disclosure Applied Materials, Inc. New systems enable precision materials engineering in high-aspec

New systems enable precision materials engineering in high-aspect-ratio 3D logic and memory chip structures Centris™ Spectral™ SiN ALD leverages innovative microwave plasma technology to deliver uniform silicon nitride deposition in challenging 3D structures Producer™ Selectra™ Mo Etch selectively removes molybdenum for wordline separation to enable 3D NAND scaling The new systems are being used b

PRESS RELEASE — Researchers led by Illinois Grainger Engineering professor Qing Cao have demonstrated a scalable way to directly and sequentially stack high-performance silicon circuits. This advance marks a critical step toward realizing the full potential of three-dimensional chips that could carry computing beyond the limits of traditional scaling. For more than half a century, the power of co

Tech Industry Manufacturing Semiconductors Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management News By Luke James published 20 minutes ago China now has a prototype tool designed for vertical circuit stacking. (Image credit: Getty Images) Share this article 0 Join the conversatio

The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.